Innovative methods using palm frond-derived activated carbon for Cu (II) adsorption

IF 4.3 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Chemistry and Physics Pub Date : 2025-02-24 DOI:10.1016/j.matchemphys.2025.130568
W.A. Hammad , Fahad M. Alqahtani , M.A. Darweesh , M.H.A. Amr , Basant Eweida , Ahmed Bakr
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引用次数: 0

Abstract

Industrial wastewater often contains high levels of heavy metals, posing significant environmental and public health risks. This study investigates the adsorption efficiency of activated carbon derived from palm fronds treated with H3PO4 (ACTPFs) for the removal of copper ions (Cu (II)) from aqueous solutions. Batch experiments were conducted at room temperature (25 ± 1 °C) to examine the effects of pH, initial metal concentration, adsorbent dosage, and contact time on adsorption. Characterization of ACTPFs was performed using BET (surface area and porosity), SEM (surface morphology), FT-IR, and XRD techniques. The results showed that ACTPFs achieved a Cu (II) removal efficiency of 99.65 % within 90 min under neutral conditions. Thermodynamic studies indicated that the adsorption process is spontaneous and feasible, as evidenced by negative ΔG° values, while positive ΔH° and ΔS° values suggested endothermic and entropy-driven adsorption. Kinetic analysis revealed that the adsorption followed both Freundlich and Langmuir isotherm models, demonstrating favorable adsorption characteristics. The findings confirm that H3PO4-treated palm frond-derived activated carbon is a cost-effective, environmentally friendly, and highly efficient adsorbent for the removal of Cu (II) from industrial wastewater.
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来源期刊
Materials Chemistry and Physics
Materials Chemistry and Physics 工程技术-材料科学:综合
CiteScore
8.70
自引率
4.30%
发文量
1515
审稿时长
69 days
期刊介绍: Materials Chemistry and Physics is devoted to short communications, full-length research papers and feature articles on interrelationships among structure, properties, processing and performance of materials. The Editors welcome manuscripts on thin films, surface and interface science, materials degradation and reliability, metallurgy, semiconductors and optoelectronic materials, fine ceramics, magnetics, superconductors, specialty polymers, nano-materials and composite materials.
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