Dan Fang, Sen Ding, Yuhan Liu, Qian Zhou, Biao Qi, Bing Ji, Bingpu Zhou
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引用次数: 0
Abstract
“Stick-slip” phenomenon that occurs when human fingertip scans across a specific surface is essential to perceive the interactions between skin and the surface. Understanding the “stick-slip” behavior is important for bionic flexible system in applications from advanced robotics to intelligent tactile sensors. However, it is often overlooked owing to the limitations to mimic the soft skin that can tangentially deform/recover with informative electrical feedback. Here, a sandwich-type device with deformable ridge-layer is proposed to analyze the characteristic of stick/slip states in “stick-slip” process. Specifically, it is observed that fast recovery of the sensing architecture is caused by dynamic slip phase that generates periodical signals based on principle of induction. The results experimentally show that periods of the electrical pulses are dependent on factors such as inherent properties (e.g., modulus and geometry) and operational parameters (e.g., scanning speed and normal load), which is consistent with the theoretical model. Furthermore, it is found that the transition between “stick-slip” and full slip could qualitatively reflect interfacial properties such as moisture, roughness, and topology. It is expected that the results can strengthen the understanding of “stick-slip” behavior when fingertip interacts with a surface and provide guidance of flexible sensor design to enrich the biomimetic perceptions.
期刊介绍:
Advanced Materials, one of the world's most prestigious journals and the foundation of the Advanced portfolio, is the home of choice for best-in-class materials science for more than 30 years. Following this fast-growing and interdisciplinary field, we are considering and publishing the most important discoveries on any and all materials from materials scientists, chemists, physicists, engineers as well as health and life scientists and bringing you the latest results and trends in modern materials-related research every week.