Design of Multifunctional Multiway Filtering Power Dividers Based on Tri-Mode Resonators

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-11-13 DOI:10.1109/TCPMT.2024.3496863
Chi-Feng Chen;Yu-Sheng Zeng;Yi-Chen Yeh;Tsang-Ning Tien;Ruo-Yin Yang;Chun-Hsiang Lo
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Abstract

This article presents an innovative design methodology for multiway filtering power dividers that can perform both power splitting and filtering functions in a compact package. In this methodology, tri-mode resonators are used to achieve circuit miniaturization and a wide stopband. To validate the methodology, the four-, six-, and eight-way filtering power dividers based on tri-mode stub-loaded resonators were designed and fabricated; their circuit areas were small at $0.089\lambda _{g}^{2}$ , $0.108\lambda _{g}^{2}$ , and $0.102\lambda _{g}^{2}$ , respectively. The study determined that introducing additional transmission zeros can enhance the frequency selectivity and stopband attenuation. Furthermore, incorporating appropriate resistors can improve the output port return losses and port-to-port isolation. Finally, both simulations and experimental measurements confirmed that the proposed multiway filtering power dividers are compact and have high frequency selectivity, high isolation, and wide stopbands, making them suitable for modern wireless communication systems.
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基于三模谐振器的多功能多路滤波功率分配器的设计
本文提出了一种创新的多路滤波功率分配器的设计方法,它可以在一个紧凑的封装中同时执行功率分割和滤波功能。在这种方法中,使用三模谐振器来实现电路小型化和宽阻带。为了验证该方法,设计并制作了基于三模桩负载谐振器的四路、六路和八路滤波功率分压器;它们的电路面积很小,分别为$0.089\lambda _{g}^{2}$、$0.108\lambda _{g}^{2}$和$0.102\lambda _{g}^{2}$。研究表明,引入额外的传输零可以提高频率选择性和阻带衰减。此外,结合适当的电阻可以改善输出端口返回损耗和端口到端口隔离。最后,仿真和实验测量均证实了所提出的多路滤波功率分配器结构紧凑,具有高频率选择性、高隔离性和宽阻带等特点,适用于现代无线通信系统。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Corrections to “Stable HIPPO-Based Circuit Macro-Modeling” IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors
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