Recent progress in bipolar and heterojunction bipolar transistors on SOI

Abstract

This article discusses the intricate advancements in lateral bipolar transistors (LBJT) and devices based on silicon germanium (SiGe) lateral hetero-junction bipolar transistors (LHBT). The paper also addresses the developments in vertical SiGe HBTs, and the challenges encountered in fabricating vertical devices on SOI substrates and demonstrates how these hurdles can be mitigated through lateral device technology. Owing to their compatibility with the complementary metal–oxide–semiconductor (CMOS) field effect transistor (FET) process and their appealing prospects in mixed-signal radio frequency applications, SiGe HBT devices remain a compelling choice. Integrating silicon-on-insulator (SOI) substrates eliminates parasitic components, rendering it to be an attractive option when coupled with SiGe HBT technology. This article explores various SOI-based lateral devices, elucidating their architectures and performance characteristics. It notably underscores our recent endeavors concerning the 28 nm fully-depleted SOI (FDSOI)-based SiGe HBT.