Preliminary 2D elastoplastic modeling of gate cracking in SiC MOSFETs under short-circuit conditions across a wide temperature-range using rankine's damage energetic approach
Mustafa Shqair, Emmanuel Sarraute, Frédéric Richardeau
{"title":"Preliminary 2D elastoplastic modeling of gate cracking in SiC MOSFETs under short-circuit conditions across a wide temperature-range using rankine's damage energetic approach","authors":"Mustafa Shqair, Emmanuel Sarraute, Frédéric Richardeau","doi":"10.1016/j.microrel.2025.115757","DOIUrl":null,"url":null,"abstract":"<div><div>For the first time in SiC MOSFETs, structural and physical modeling of the Intermediate-Layer-Dielectric (ILD) cracking in a planar gate under short-pulse short-circuit conditions is proposed. This approach employs an energy-based Rankine damage model, relying on the SiO<sub>2</sub> mechanical properties. The Rankine model has been effectively integrated into a comprehensive 2D electrothermal-metallurgical and elastoplastic-mechanical model across a wide range of temperatures. Initial results enable the extraction of crack penetration depth from a single pulse, paving the way for estimating the average number of critical cycles leading to a potentially complete destructive ILD fracture.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"170 ","pages":"Article 115757"},"PeriodicalIF":2.5000,"publicationDate":"2025-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425001702","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2025/4/25 0:00:00","PubModel":"Epub","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
For the first time in SiC MOSFETs, structural and physical modeling of the Intermediate-Layer-Dielectric (ILD) cracking in a planar gate under short-pulse short-circuit conditions is proposed. This approach employs an energy-based Rankine damage model, relying on the SiO2 mechanical properties. The Rankine model has been effectively integrated into a comprehensive 2D electrothermal-metallurgical and elastoplastic-mechanical model across a wide range of temperatures. Initial results enable the extraction of crack penetration depth from a single pulse, paving the way for estimating the average number of critical cycles leading to a potentially complete destructive ILD fracture.
期刊介绍：
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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