Low-Cost, High-Frequency, Data Acquisition System for Condition Monitoring of Rotating Machinery through Vibration Analysis-Case Study.

IF 4.3 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2020-06-20 DOI:10.3390/s20123493
César Ricardo Soto-Ocampo, José Manuel Mera, Juan David Cano-Moreno, José Luis Garcia-Bernardo
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引用次数: 14

Abstract

Data acquisition is a crucial stage in the execution of condition monitoring (CM) of rotating machinery, by means of vibration analysis. However, the major challenge in the execution of this technique lies in the features of the recording equipment (accuracy, resolution, sampling frequency and number of channels) and the cost they represent. The present work proposes a low-cost data acquisition system, based on Raspberry-Pi, with a high sampling frequency capacity in the recording of up to three channels. To demonstrate the effectiveness of the proposed data acquisition system, a case study is presented in which the vibrations registered in a bearing are analyzed for four degrees of failure.

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基于振动分析的旋转机械状态监测低成本、高频数据采集系统-案例研究。
通过振动分析对旋转机械进行状态监测,数据采集是进行状态监测的关键环节。然而,执行这项技术的主要挑战在于记录设备的特点(精度、分辨率、采样频率和通道数量)和它们所代表的成本。本研究提出了一种基于树莓派的低成本数据采集系统,该系统具有高采样频率容量,最多可记录三个通道。为了证明所提出的数据采集系统的有效性,提出了一个案例研究,其中在轴承中记录的振动被分析为四个程度的故障。
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来源期刊
CiteScore
7.20
自引率
4.30%
发文量
567
期刊介绍: ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/​Abstracted: Web of Science SCIE Scopus CAS INSPEC Portico
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