A Reduced Model Based On Proper Generalized Decomposition for the Fast Analysis of Igbt Power Modules Lifetime

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2022-02-08 DOI:10.1115/1.4053767
Lou Schuler, L. Chamoin, Z. Khatir, M. Berkani, M. Ouhab, N. Degrenne
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引用次数: 2

Abstract

A reduced weakly-coupled thermo-mechanical model based on the Proper Generalized Decomposition method was developed for the numerical analysis of power modules. The employed model reduction method enabled to obtain, in a preliminary offline phase, the solution of the thermo-mechanical problem over a large range of design parameters, with much time saving compared to a classical (brute force) multi-resolution finite element method. In an online post-processing phase, the power module lifetime, modeled with a strain-life law, was then computed in a straightforward manner by rapidly evaluating the solution for any value of the parameters. Sensitivity analysis was conducted to select parameters values leading to acceptable module lifetimes with respect to given criteria. A robust design study was also performed to illustrate the performance of the proposed approach.
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基于适当广义分解的光功率模块寿命快速分析简化模型
基于适当广义分解方法,建立了一个简化的弱耦合热力力学模型,用于功率模块的数值分析。与经典(强力)多分辨率有限元方法相比,所采用的模型简化方法能够在初步离线阶段获得大范围设计参数下的热机械问题的解决方案,节省了大量时间。在在线后处理阶段,通过快速评估任何参数值的解决方案,以直接的方式计算用应变寿命定律建模的功率模块寿命。进行灵敏度分析以选择参数值,从而根据给定标准获得可接受的模块寿命。还进行了稳健设计研究,以说明所提出方法的性能。
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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