Improving Ambient Contrast Ratio of Display Device At Oblique Angle Using a Fe3o4-magnetic Particle Chained Pillar Array Structure

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2023-04-21 DOI:10.1115/1.4062383
Zongtao Li, Junhao Wu, Guanwei Liang, Renpeng Yang, Zhihui Yang, Jiasheng Li
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Abstract

A high ambient contrast ratio (ACR) is essential for achieving a high dynamic range in advanced display applications, but reported ACR enhancement strategies always result in reduced optical efficiency of light-emitting diode (LED) display devices. In this study, an Fe3O4-magnetic particle-chained pillar array (Fe3O4-MPCP) structure was introduced to improve the ACR of LED display devices with low optical loss. The results indicated that the MPCP structure achieved high ACR at an oblique angle using surface pillar array to suppress ambient light reflections, and its internal magnetic particle chain improved the transmissivity to maintain high device efficiency. Compared with the commercial graphite-coated device at typical viewing angles (i.e., 0° and 60°), the ACR of the optimal MPCP device increased by 217 and 140%, while the device efficiency increased by 25 and 12%, respectively. Therefore, the proposed method provides a novel approach for significantly improving ACR at all oblique angles while maintaining high device efficiency, which can be easily integrated into various LED display devices and has significant potential in advanced display applications.
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利用fe3o4磁颗粒链柱阵列结构提高斜角度显示器件的环境对比度
在先进的显示应用中,高环境对比度(ACR)是实现高动态范围的必要条件,但已有的ACR增强策略总是导致发光二极管(LED)显示器件的光学效率降低。本研究提出了一种fe3o4 -磁颗粒链柱阵列(Fe3O4-MPCP)结构,以提高低光损耗LED显示器件的ACR。结果表明,MPCP结构利用表面柱阵列抑制环境光反射,实现了斜角度下的高ACR,其内部磁颗粒链提高了透过率,保持了较高的器件效率。在典型视角(0°和60°)下,与商用石墨涂层器件相比,优化后的MPCP器件的ACR分别提高了217和140%,器件效率分别提高了25%和12%。因此,该方法提供了一种新的方法,可以在保持高器件效率的同时显著提高所有斜角的ACR,可以很容易地集成到各种LED显示器件中,在高级显示应用中具有很大的潜力。
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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