{"title":"Investigation of microstructure evolution on different planes in laser welding of aluminum alloy","authors":"Yuewei Ai, Shibo Han, Yachao Yan","doi":"10.2351/7.0001129","DOIUrl":null,"url":null,"abstract":"The solidification behavior of a molten pool is a critical factor affecting the mechanical properties of welded joints. This paper develops a multi-scale model combining the macroscale heat transfer and fluid flow model with the microscale phase field model for calculating the microstructure evolution on two different planes that are perpendicular to the thickness direction in the laser welding of the aluminum alloy. To obtain the time-varying temperature gradient (G) and solidification velocity (R) used in the simulation, a transient solidification conditions model is proposed. These models are validated by comparing the simulation results with the experimental results. The results indicate that G decreases, while R increases during solidification process. G/R decreases on both two planes, which results in the transformation of the microstructure from planar to cellular and then to the columnar grain. Additionally, it is found that the primary dendrite arm spacing of columnar grains on the lower plane is smaller, which is related to lower G−1/2R−1/4.","PeriodicalId":50168,"journal":{"name":"Journal of Laser Applications","volume":" ","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Laser Applications","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.2351/7.0001129","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 1
Abstract
The solidification behavior of a molten pool is a critical factor affecting the mechanical properties of welded joints. This paper develops a multi-scale model combining the macroscale heat transfer and fluid flow model with the microscale phase field model for calculating the microstructure evolution on two different planes that are perpendicular to the thickness direction in the laser welding of the aluminum alloy. To obtain the time-varying temperature gradient (G) and solidification velocity (R) used in the simulation, a transient solidification conditions model is proposed. These models are validated by comparing the simulation results with the experimental results. The results indicate that G decreases, while R increases during solidification process. G/R decreases on both two planes, which results in the transformation of the microstructure from planar to cellular and then to the columnar grain. Additionally, it is found that the primary dendrite arm spacing of columnar grains on the lower plane is smaller, which is related to lower G−1/2R−1/4.
期刊介绍:
The Journal of Laser Applications (JLA) is the scientific platform of the Laser Institute of America (LIA) and is published in cooperation with AIP Publishing. The high-quality articles cover a broad range from fundamental and applied research and development to industrial applications. Therefore, JLA is a reflection of the state-of-R&D in photonic production, sensing and measurement as well as Laser safety.
The following international and well known first-class scientists serve as allocated Editors in 9 new categories:
High Precision Materials Processing with Ultrafast Lasers
Laser Additive Manufacturing
High Power Materials Processing with High Brightness Lasers
Emerging Applications of Laser Technologies in High-performance/Multi-function Materials and Structures
Surface Modification
Lasers in Nanomanufacturing / Nanophotonics & Thin Film Technology
Spectroscopy / Imaging / Diagnostics / Measurements
Laser Systems and Markets
Medical Applications & Safety
Thermal Transportation
Nanomaterials and Nanoprocessing
Laser applications in Microelectronics.