Ricky Tsun-Sheng Chou, J. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, H. Liu, T. Tseng
{"title":"Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill","authors":"Ricky Tsun-Sheng Chou, J. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, H. Liu, T. Tseng","doi":"10.4071/imaps.1546248","DOIUrl":null,"url":null,"abstract":"\n In this study, the heterogeneous integration of two chips on a 2.3D hybrid substrate using solder joint and underfill is investigated. Emphasis is placed on the materials, design, process, fabrication, and reliability of the package. Drop test and results of the package are also provided.","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":"1 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/imaps.1546248","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 4
Abstract
In this study, the heterogeneous integration of two chips on a 2.3D hybrid substrate using solder joint and underfill is investigated. Emphasis is placed on the materials, design, process, fabrication, and reliability of the package. Drop test and results of the package are also provided.
期刊介绍：
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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