SYNTHESIS OF Cu2ZnSnS4 BY MECHANICAL ALLOYING METHOD FOR THERMOELECTRIC APPLICATION

IF 1.1 Q3 METALLURGY & METALLURGICAL ENGINEERING Acta Metallurgica Slovaca Pub Date : 2019-09-25 DOI:10.12776/ams.v25i3.1311
L. Bui, Khanh-Van Nguyen, B. Duong, Thang Hong Le, Bang Thi Le, S. Said
{"title":"SYNTHESIS OF Cu2ZnSnS4 BY MECHANICAL ALLOYING METHOD FOR THERMOELECTRIC APPLICATION","authors":"L. Bui, Khanh-Van Nguyen, B. Duong, Thang Hong Le, Bang Thi Le, S. Said","doi":"10.12776/ams.v25i3.1311","DOIUrl":null,"url":null,"abstract":"Quaternary chalcogenide Cu2ZnSnS4 is a potential candidate for thermoelectric (TE) application due to a number of advantages including containing only non-toxic and abundant elements, high Seebeck coefficient and low thermal conductivity. In this study, Cu2ZnSnS4 was synthesized using mechanical alloying method from Cu, Zn, Sn and S powders. In order to study the effect of milling duration on the formation of Cu2ZnSnS4, different milling duration of 2, 4, 12 and 16 h were investigated. As the results, Cu2ZnSnS4 was started to form after milling for 12 h. The formation of Cu2ZnSnS4 was completed after 16 h of milling. In addition, Cu2ZnSnS4 nanoparticles were obtained after 16 h of milling with the distribution mostly in the range of 50 - 60 nm.","PeriodicalId":44511,"journal":{"name":"Acta Metallurgica Slovaca","volume":" ","pages":""},"PeriodicalIF":1.1000,"publicationDate":"2019-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Acta Metallurgica Slovaca","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.12776/ams.v25i3.1311","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"METALLURGY & METALLURGICAL ENGINEERING","Score":null,"Total":0}
引用次数: 1

Abstract

Quaternary chalcogenide Cu2ZnSnS4 is a potential candidate for thermoelectric (TE) application due to a number of advantages including containing only non-toxic and abundant elements, high Seebeck coefficient and low thermal conductivity. In this study, Cu2ZnSnS4 was synthesized using mechanical alloying method from Cu, Zn, Sn and S powders. In order to study the effect of milling duration on the formation of Cu2ZnSnS4, different milling duration of 2, 4, 12 and 16 h were investigated. As the results, Cu2ZnSnS4 was started to form after milling for 12 h. The formation of Cu2ZnSnS4 was completed after 16 h of milling. In addition, Cu2ZnSnS4 nanoparticles were obtained after 16 h of milling with the distribution mostly in the range of 50 - 60 nm.
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热电用机械合金化法合成Cu2ZnSnS4
第四代硫系化合物Cu2ZnSnS4具有无毒、元素丰富、塞贝克系数高、导热系数低等优点,是热电(TE)材料的潜在候选材料。本研究以Cu、Zn、Sn和S粉末为原料,采用机械合金化法制备了Cu2ZnSnS4。为了研究铣削时间对Cu2ZnSnS4形成的影响,分别对铣削时间2、4、12和16 h进行了研究。结果表明,铣削12 h后Cu2ZnSnS4开始形成,铣削16 h后Cu2ZnSnS4完全形成。另外,经过16 h的铣削,得到了Cu2ZnSnS4纳米颗粒,其分布范围主要在50 ~ 60 nm。
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来源期刊
Acta Metallurgica Slovaca
Acta Metallurgica Slovaca METALLURGY & METALLURGICAL ENGINEERING-
CiteScore
2.00
自引率
30.00%
发文量
22
审稿时长
12 weeks
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