Voltage sag compensation at load side in armor fighting vehicles using ultra capacitor

IF 0.8 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Circuit World Pub Date : 2022-07-29 DOI:10.1108/cw-09-2021-0247
S. N, Hosimin Thilagar S.
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Abstract

Purpose The purpose of this paper rapid development of various voltage sag compensation techniques in DC bus using ultra-capacitors (UCs) provides satisfactory results when compared with required peak power demand for shorter duration. Later, UCs have been used as floating capacitors [1] [2]. Various UCs are available based on internal resistances which also rely on its manufacturing materials, similar to double layer capacitors. Design/methodology/approach This paper demonstrates UCs based voltage sag compensation at load side under different working modes of hydraulic pack (HP) in an armored fighting vehicle (AFV). The main sources to supply the HP are 24 V, 400 Ahr battery bank and 20 kW main generator. HP is considered to be the highest power load of a system. 2,500 A inrush current was drawn by HP during initial conditions, and also, this system works in both elevation and azimuth mode. Voltage sag has been varied from 15 to 24 V for different modes. But as per the military standard, electrical systems should operate between 18 and 32 V DC. Because of insufficient terminal voltage, required energy cannot be attained and supplied to the loads. The proposed topology compensated the voltage sag and maintains nominal voltage on a DC bus. The devised circuit has been verified under all possible operating loads such as continuous, intermittent and momentary. The same has been simulated using MATLAB/Simulink and was experimentally verified. The minimum voltage maintained in a DC bus is 22.2 V in simulation, while experimentally, it was 24.2 V. Findings For getting higher percentage of efficiency, secondary energy system configuration, mainly designed for electrical vehicles, is needed. It was implemented and same was tested with the fighting vehicle system[1]. The proposed configuration comprises of bank of an UC and a battery bank. The system was finally implemented in AFVs. Originality/value The goods vehicles made of UCs can hold very minimum energy because of minimum density of energy. The modified AFV can have minimum charging as well as discharging of rate of energy and, thus, power[3][4]. Thus, the proposed idea of modified vehicle system has influence over significant change in the state of charge.
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用超级电容器补偿装甲战车负载侧电压凹陷
目的本文的目的是快速发展使用超电容器(UC)的直流母线中的各种电压暂降补偿技术,与所需的较短持续时间的峰值功率需求相比,能提供令人满意的结果。后来,UC被用作浮动电容器[1][2]。基于内部电阻可提供各种UC,内部电阻也依赖于其制造材料,类似于双层电容器。设计/方法/方法本文演示了在装甲战车(AFV)中液压组件(HP)的不同工作模式下,基于UC的负载侧电压暂降补偿。提供HP的主要电源是24 V、400 Ahr电池组和20 kW主发电机。HP被认为是系统的最高功率负载。在初始条件下,HP抽取了2500 A的浪涌电流,并且该系统在仰角和方位角模式下都工作。对于不同的模式,电压暂降在15到24伏之间变化。但根据军事标准,电气系统应在18至32伏直流电之间运行。由于端子电压不足,无法获得所需的能量并将其提供给负载。所提出的拓扑结构补偿了电压暂降并保持了直流母线上的标称电压。设计的电路已在所有可能的工作负载下进行了验证,如连续、间歇和瞬时负载。使用MATLAB/Simulink对其进行了仿真,并进行了实验验证。在模拟中,直流母线中保持的最小电压为22.2V,而在实验中为24.2V。为了获得更高的效率百分比,需要主要为电动汽车设计的二次能源系统配置。它得到了实施,并在战车系统中进行了测试[1]。所提出的配置包括UC组和电池组。该系统最终在AFVs.Originality/value中实现。由于能量密度最小,由UC制成的货车可以保持非常小的能量。修改后的AFV可以具有最小的充电和能量放电速率,从而具有功率[3][4]。因此,所提出的改进车辆系统的想法对充电状态的显著变化具有影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Circuit World
Circuit World 工程技术-材料科学:综合
CiteScore
2.60
自引率
0.00%
发文量
33
审稿时长
>12 weeks
期刊介绍: Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes. Circuit World covers a broad range of topics, including: • Circuit theory, design methodology, analysis and simulation • Digital, analog, microwave and optoelectronic integrated circuits • Semiconductors, passives, connectors and sensors • Electronic packaging of components, assemblies and products • PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes) • Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal) • Internet of Things (IoT).
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