S. Trolier-McKinstry, Wanlin Zhu, Betul Akkopru‐Akgun, Fan He, S. Ko, C. Fragkiadakis, Peter Mardilovich
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引用次数: 0
Abstract
Thin films based on PbZr1−x Ti x O3 and K1−x Na x NbO3 are increasingly being commercialized in piezoelectric MEMS due to the comparatively low drive voltages required relative to bulk actuators, as well as the facile approach to making sensor or actuator arrays. As these materials are incorporated into devices, it is critically important that they operate reliably over the lifetime of the system. This paper discusses some of the factors controlling the electrical and electromechanical reliability of lead zirconate titanate (PZT)-based piezoMEMS films. In particular, it will be shown the gradients in the Zr/Ti ratio through the depth of the films are useful in increasing the lifetime of the films under DC electrical stresses.
基于PbZr1−x Ti x O3和K1−x Na x NbO3的薄膜在压电MEMS中越来越商业化,这是由于相对于体致动器所需的相对较低的驱动电压,以及制造传感器或致动器阵列的简单方法。由于这些材料被结合到设备中,因此它们在系统的整个寿命内可靠运行至关重要。本文讨论了控制锆钛酸铅(PZT)基压电MEMS薄膜电气和机电可靠性的一些因素。特别地,将显示出Zr/Ti比率通过膜的深度的梯度有助于在DC电应力下增加膜的寿命。
期刊介绍:
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS