An Automatic Fem-bem Coupling Method for Elastic-plastic Problems of Multiscale Structures in Electronic Packaging

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2022-08-01 DOI:10.1115/1.4055125
F. Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen
{"title":"An Automatic Fem-bem Coupling Method for Elastic-plastic Problems of Multiscale Structures in Electronic Packaging","authors":"F. Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen","doi":"10.1115/1.4055125","DOIUrl":null,"url":null,"abstract":"\n We introduce a coupled finite and boundary element method for elastic-plastic analysis over multiscale electronic packaging structures. Based on the FE-BE coupling algorithm, an automatic implementation procedure for the coupling of the Abaqus with a self-written elastic BE code is introduced for elastic problems. In the mixed FEM-BEM model, the effective stiffness and effective forces at the interfacial boundary are evaluated by the self-written BE code. Then, the obtained effective stiffness and effective forces are assembled to the global FE formulations by using the user subroutine (UEL) in Abaqus. Numerical simulation of structures with plastic deformation, stress concentration, etc. is carried out by using FEM theory. The boundary element method is used for linear elastic domains with large-scale structure. The proposed method offers several key improvements compared with current analysis methods available for multi-scale electronic packaging structures. The benefits are: (i) the powerful pre- and post-processing of ABAQUS; (ii) the higher accuracy of the solution; (iii) the computational cost and time can be reduced by using the scheme; and (iv) solving systems with infinite extension by using the BEM as a supplement. Furthermore, we demonstrate the ability of the proposed approach to handle multiscale structures in electronic packaging problems.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4055125","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 1

Abstract

We introduce a coupled finite and boundary element method for elastic-plastic analysis over multiscale electronic packaging structures. Based on the FE-BE coupling algorithm, an automatic implementation procedure for the coupling of the Abaqus with a self-written elastic BE code is introduced for elastic problems. In the mixed FEM-BEM model, the effective stiffness and effective forces at the interfacial boundary are evaluated by the self-written BE code. Then, the obtained effective stiffness and effective forces are assembled to the global FE formulations by using the user subroutine (UEL) in Abaqus. Numerical simulation of structures with plastic deformation, stress concentration, etc. is carried out by using FEM theory. The boundary element method is used for linear elastic domains with large-scale structure. The proposed method offers several key improvements compared with current analysis methods available for multi-scale electronic packaging structures. The benefits are: (i) the powerful pre- and post-processing of ABAQUS; (ii) the higher accuracy of the solution; (iii) the computational cost and time can be reduced by using the scheme; and (iv) solving systems with infinite extension by using the BEM as a supplement. Furthermore, we demonstrate the ability of the proposed approach to handle multiscale structures in electronic packaging problems.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
电子封装中多尺度结构弹塑性问题的Fem-bem自动耦合方法
我们介绍了一种用于多尺度电子封装结构弹塑性分析的有限元和边界元耦合方法。基于FE-BE耦合算法,针对弹性问题,介绍了一种自动实现Abaqus与自写弹性BE码耦合的过程。在混合FEM-BEM模型中,界面边界处的有效刚度和有效力通过自行编写的BE程序进行评估。然后,使用Abaqus中的用户子程序(UEL)将获得的有效刚度和有效力组装到全局有限元公式中。利用有限元理论对具有塑性变形、应力集中等情况的结构进行了数值模拟。边界元法适用于具有大型结构的线弹性域。与目前可用于多尺度电子封装结构的分析方法相比,所提出的方法提供了几个关键改进。其优点是:(i)ABAQUS强大的预处理和后处理功能;(ii)解的精度越高;(iii)通过使用该方案可以减少计算成本和时间;以及(iv)通过使用边界元作为补充来求解具有无限可拓性的系统。此外,我们还证明了所提出的方法处理电子封装问题中的多尺度结构的能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
期刊最新文献
Simultaneous Characterization of Both Ctes and Thermal Warpages of Flip-Chip Packages with a Cap Using Strain Gauges Research Status and Progress On Non-Destructive Testing Methods for Defect Inspection of Microelectronic Packaging Effects of Thermal-Moisture Coupled Field On Delamination Behavior of Electronic Packaging Heat Dissipation Design Based On Topology Optimization And Auxiliary Materials Optimal Design of Thermal Cycling Reliability For PBGA Assembly via FEM and Taguchi Method
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1