Wetting Properties of Aluminium Surface Structures Fabricated Using Direct Laser Interference Patterning with Picosecond and Femtosecond Pulses

IF 0.8 4区 材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY Journal of Laser Micro Nanoengineering Pub Date : 2021-04-01 DOI:10.2961/jlmn.2021.01.2013
Stephan Milles, J. Dahms, B. Voisiat, Simonas, A. Fábián, Lasagni
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引用次数: 3

Abstract

In this work, we report about the fabrication of textured aluminium surfaces using Direct Laser Interference Patterning with picosecond (70 ps) and femtosecond (400 fs) laser pulses as well as their wetting properties. The structuring process was performed by varying the pulse numbers from 25 to 250, resulting in various depths ranging from 0.9 μm to 6.8 μm. The wetting analysis shows that the ps-patterned surfaces exhibit long-term superhydrophobic characteristics (at 21 °C and 16 % air humidity). Differently, for the fs-processed substrates, a hydrophobic character was firstly observed, which later (after 16 days) dropped to contact angles similar as the untreated material.
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皮秒和飞秒脉冲直接激光干涉图案化铝表面结构的润湿性能
在这项工作中,我们报道了使用皮秒(70ps)和飞秒(400fs)激光脉冲的直接激光干涉图案化制备纹理铝表面及其润湿性能。通过将脉冲数从25改变到250来执行结构化过程,从而产生0.9μm到6.8μm的不同深度。润湿分析表明,ps图案化表面表现出长期的超疏水特性(在21°C和16%的空气湿度下)。不同的是,对于fs处理的基材,首先观察到疏水性,随后(16天后)降至与未处理材料相似的接触角。
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来源期刊
Journal of Laser Micro Nanoengineering
Journal of Laser Micro Nanoengineering 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
18
审稿时长
3 months
期刊介绍: Journal of Laser Micro/Nanoengineering, founded in 2005 by Japan Laser Processing Society (JLPS), is an international online journal for the rapid publication of experimental and theoretical investigations in laser-based technology for micro- and nano-engineering. Access to the full article is provided free of charge. JLMN publishes regular articles, technical communications, and invited papers about new results related to laser-based technology for micro and nano engineering. The articles oriented to dominantly technical or industrial developments containing interesting and useful information may be considered as technical communications.
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