Ultrafast laser processing of glass waveguide substrates for multi-fiber connectivity in co-packaged optics

IF 2.3 Q2 OPTICS Advanced Optical Technologies Pub Date : 2023-08-30 DOI:10.3389/aot.2023.1244009
Jason R. Grenier, L. Brusberg, K. Wieland, Juergen Matthies, Chad C. Terwilliger
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Abstract

High bandwidth demanding applications such as high-performance computing and hyperscale datacenters are drivers for co-packaged optics, which aims to bring optical signals as close as possible to the electrical computing chips by integrating the electro-optic transceivers and ASICs on the same package substrate. These next-generation switches require advanced fiber-to-chip connectivity and novel packaging concepts to enable sufficient power and cost savings. As such, low-loss, high bandwidth, and high fiber-counts are required at the photonic chip interface. In this work, these challenges are addressed by enabling the multi-fiber push-on (MPO) interface at the edge of integrated glass waveguide substrates and thus leverages the existing fiber connector eco-system. An ultrafast laser process is used to singulate glass wafers into individual photonic chips leaving optical-quality end-facets with <1 μm flatness over the 6.5 mm wide connector region thereby directly enabling low-loss fiber-to-chip edge-coupling. To overcome the high-costs and complex photonic packaging associated with active alignment of the fiber connectors to the glass waveguide interfaces, ultrafast laser-ablated features are accurately positioned on the glass substrate to enable self-alignment of the MPO connector guide-pins resulting in a passive alignment approach. Subsequent mating and de-mating of the MPO connector to the glass waveguide interface yields on average a 0.19 dB increase in the coupling loss compared to using active alignment.
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用于共封装光学器件中多光纤连接的玻璃波导衬底的超快激光处理
高性能计算和超大规模数据中心等高带宽应用是共封装光学器件的驱动因素,该器件旨在通过在同一封装基板上集成电光收发器和ASIC,使光信号尽可能接近电计算芯片。这些下一代交换机需要先进的光纤到芯片连接和新颖的封装概念,以实现足够的功率和成本节约。因此,在光子芯片接口处需要低损耗、高带宽和高光纤计数。在这项工作中,通过在集成玻璃波导基板的边缘启用多光纤推入式(MPO)接口来解决这些挑战,从而利用现有的光纤连接器生态系统。使用超快激光工艺将玻璃晶片分割成单个光子芯片,在6.5mm宽的连接器区域上留下平坦度<1μm的光学质量端面,从而直接实现低损耗光纤到芯片的边缘耦合。为了克服与光纤连接器与玻璃波导接口的主动对准相关的高成本和复杂的光子封装,超快激光烧蚀特征被精确地定位在玻璃基板上,以实现MPO连接器导销的自对准,从而产生被动对准方法。MPO连接器与玻璃波导接口的后续配合和解除配合与使用有源对准相比,平均产生0.19dB的耦合损耗增加。
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来源期刊
CiteScore
4.40
自引率
0.00%
发文量
23
期刊介绍: Advanced Optical Technologies is a strictly peer-reviewed scientific journal. The major aim of Advanced Optical Technologies is to publish recent progress in the fields of optical design, optical engineering, and optical manufacturing. Advanced Optical Technologies has a main focus on applied research and addresses scientists as well as experts in industrial research and development. Advanced Optical Technologies partners with the European Optical Society (EOS). All its 4.500+ members have free online access to the journal through their EOS member account. Topics: Optical design, Lithography, Opto-mechanical engineering, Illumination and lighting technology, Precision fabrication, Image sensor devices, Optical materials (polymer based, inorganic, crystalline/amorphous), Optical instruments in life science (biology, medicine, laboratories), Optical metrology, Optics in aerospace/defense, Simulation, interdisciplinary, Optics for astronomy, Standards, Consumer optics, Optical coatings.
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