Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2022-11-24 DOI:10.1115/1.4056305
I. Kaur, S. Mujahid, YubRaj Paudel, H. Rhee, Prashant Singh
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引用次数: 3

Abstract

Single unit cell thick lattice frame materials have applications in efficient heat exchangers. The present study is focused on strut-based sandwich-type configurations obtained through reticulation of unit cell topologies of Tetrakaidecahedron, Octet, and Rhombic dodecahedron shapes at a porosity of 0.9 with water as the working fluid. Interfacial heat transfer coefficient values on struts and endwalls were determined by imposing constant temperature boundary condition. Averaged heat transfer coefficient on the endwall was the highest for Tetrakaidecahedron lattice whereas Rhombic dodecahedron lattice exhibited the highest average interfacial heat transfer coefficients on the struts. Flow analysis showed the presence of strong secondary flow features on planes normal to the mean flow direction that demonstrated the unique flow mixing capabilities of these lattices. Reported interfacial heat transfer coefficient at struts and endwall can be used in volume-averaged computations of metal foams (representative of lattices' flow and thermal properties) under local thermal non-equilibrium.
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格构式紧凑型散热器流动与传热特性的数值分析
单单元厚格构框架材料在高效换热器中具有应用。本研究的重点是通过以水为工作流体,在0.9的孔隙率下,将十面体、八面体和菱形十二面体形状的晶胞拓扑结构网状化而获得的基于支柱的三明治型结构。通过施加恒温边界条件,确定了支柱和端壁的界面传热系数值。十面体四面体晶格的端壁平均传热系数最高,而十二面体菱形晶格在支柱上表现出最高的平均界面传热系数。流动分析表明,在垂直于平均流动方向的平面上存在强烈的二次流动特征,这表明了这些晶格独特的流动混合能力。所报道的支柱和端壁处的界面传热系数可用于局部热非平衡状态下金属泡沫的体积平均计算(代表晶格的流动和热性能)。
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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