{"title":"Fabrication of Ceramic Interposers for Module Packaging","authors":"R. Alizadeh, Kaoru Porter, T. Cannon, S. Ang","doi":"10.4071/imaps.1114553","DOIUrl":null,"url":null,"abstract":"Abstract In this study, low-temperature cofired ceramic (LTCC) and 3D-printed ceramic interposers are designed and fabricated for a double-sided power electronic module. The interposer acts as elec...","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":"17 1","pages":"67-72"},"PeriodicalIF":0.0000,"publicationDate":"2020-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/imaps.1114553","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 2
Abstract
Abstract In this study, low-temperature cofired ceramic (LTCC) and 3D-printed ceramic interposers are designed and fabricated for a double-sided power electronic module. The interposer acts as elec...
期刊介绍：
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
