Assessment of micro-indentation method in the characterization of DP600 behavior using a proposed martensite distribution parameter in FEM simulation approach
Anyerson Cuervo Basurto, C. A. Narvaez Tovar, R. Rodríguez Baracaldo
{"title":"Assessment of micro-indentation method in the characterization of DP600 behavior using a proposed martensite distribution parameter in FEM simulation approach","authors":"Anyerson Cuervo Basurto, C. A. Narvaez Tovar, R. Rodríguez Baracaldo","doi":"10.22201/icat.24486736e.2022.20.6.1121","DOIUrl":null,"url":null,"abstract":"This work proposes a simulation approach to characterize the behavior of DP600 steel subjected to micro indentation tests. Axisymmetric and three-dimensional artificial RVEs were generated with statistical data from metallographic images. FEM simulations of the micro indentation tests used the Gurson model and Rodriguez-Gutierrez equation. There is proposed a new parameter called spherical radius to quantify the closeness of the hard particles to the indenter tip. The simulated 3D curves were compared with respect to a reference curve of DP600, obtaining relative errors below 20 percent. Results show that the hard particles near the indenter affect the stress, strain, and micro void fields by changing the indentation response behavior. The spherical radius allows capturing the effect of the hard particles closeness because when its value is low, or the hard particles are closer to the indenter tip, the relative error of the average curve decreases due to the hard particles are constraining the deformation caused by the indenter in the material.","PeriodicalId":15073,"journal":{"name":"Journal of Applied Research and Technology","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2022-12-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Applied Research and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.22201/icat.24486736e.2022.20.6.1121","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 1
Abstract
This work proposes a simulation approach to characterize the behavior of DP600 steel subjected to micro indentation tests. Axisymmetric and three-dimensional artificial RVEs were generated with statistical data from metallographic images. FEM simulations of the micro indentation tests used the Gurson model and Rodriguez-Gutierrez equation. There is proposed a new parameter called spherical radius to quantify the closeness of the hard particles to the indenter tip. The simulated 3D curves were compared with respect to a reference curve of DP600, obtaining relative errors below 20 percent. Results show that the hard particles near the indenter affect the stress, strain, and micro void fields by changing the indentation response behavior. The spherical radius allows capturing the effect of the hard particles closeness because when its value is low, or the hard particles are closer to the indenter tip, the relative error of the average curve decreases due to the hard particles are constraining the deformation caused by the indenter in the material.
期刊介绍:
The Journal of Applied Research and Technology (JART) is a bimonthly open access journal that publishes papers on innovative applications, development of new technologies and efficient solutions in engineering, computing and scientific research. JART publishes manuscripts describing original research, with significant results based on experimental, theoretical and numerical work.
The journal does not charge for submission, processing, publication of manuscripts or for color reproduction of photographs.
JART classifies research into the following main fields:
-Material Science:
Biomaterials, carbon, ceramics, composite, metals, polymers, thin films, functional materials and semiconductors.
-Computer Science:
Computer graphics and visualization, programming, human-computer interaction, neural networks, image processing and software engineering.
-Industrial Engineering:
Operations research, systems engineering, management science, complex systems and cybernetics applications and information technologies
-Electronic Engineering:
Solid-state physics, radio engineering, telecommunications, control systems, signal processing, power electronics, electronic devices and circuits and automation.
-Instrumentation engineering and science:
Measurement devices (pressure, temperature, flow, voltage, frequency etc.), precision engineering, medical devices, instrumentation for education (devices and software), sensor technology, mechatronics and robotics.