Chong Wang, Wang Yingjie, Kegu Adi, Yunzhong Huang, Yuanming Chen, S. Wang, Wei‐dong He, Yao Tang, Yukai Sun, Weihua Zhang, Chenggang Xu, He Xuemei
{"title":"A modified model of conductor roughness for manufacturing copper lines of printedcircuit board","authors":"Chong Wang, Wang Yingjie, Kegu Adi, Yunzhong Huang, Yuanming Chen, S. Wang, Wei‐dong He, Yao Tang, Yukai Sun, Weihua Zhang, Chenggang Xu, He Xuemei","doi":"10.1108/cw-10-2019-0144","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThe purpose of this paper is to establish an accurate model to quantify the effect of conductor roughness on insertion loss (IL) and provide improved measurements and suggestions for manufacturing good conductive copper lines of printed circuit board.\n\n\nDesign/methodology/approach\nTo practically investigates the modified model of conductor roughness, three different kinds of alternate oxidation treatments were used to provide transmission lines with different roughness. The IL results were measured by a vector net analyzer for comparisons with the modified model results.\n\n\nFindings\nAn accurate model, with only a 1.8% deviation on average from the measured values, is established. Compared with other models, the modified model is more reliable in industrial manufacturing.\n\n\nOriginality/value\nThis paper introduces the influence of tiny roughness structures on IL. Besides, this paper discusses the effect of current distribution on IL.\n","PeriodicalId":50693,"journal":{"name":"Circuit World","volume":" ","pages":""},"PeriodicalIF":0.7000,"publicationDate":"2021-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Circuit World","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/cw-10-2019-0144","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Purpose
The purpose of this paper is to establish an accurate model to quantify the effect of conductor roughness on insertion loss (IL) and provide improved measurements and suggestions for manufacturing good conductive copper lines of printed circuit board.
Design/methodology/approach
To practically investigates the modified model of conductor roughness, three different kinds of alternate oxidation treatments were used to provide transmission lines with different roughness. The IL results were measured by a vector net analyzer for comparisons with the modified model results.
Findings
An accurate model, with only a 1.8% deviation on average from the measured values, is established. Compared with other models, the modified model is more reliable in industrial manufacturing.
Originality/value
This paper introduces the influence of tiny roughness structures on IL. Besides, this paper discusses the effect of current distribution on IL.
期刊介绍：
Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.
Circuit World covers a broad range of topics, including:
• Circuit theory, design methodology, analysis and simulation
• Digital, analog, microwave and optoelectronic integrated circuits
• Semiconductors, passives, connectors and sensors
• Electronic packaging of components, assemblies and products
• PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
• Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
• Internet of Things (IoT).
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