High Gain and Wideband Antenna-in-package Solution Using Fan-out Technology

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2023-02-27 DOI:10.1115/1.4056991

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai

{"title":"High Gain and Wideband Antenna-in-package Solution Using Fan-out Technology","authors":"Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai","doi":"10.1115/1.4056991","DOIUrl":null,"url":null,"abstract":"\n The technology of fan-out wafer level packaging (FOWLP) has been widely adopted for millimeter wave Antenna-in-Package (AiP) system integration with low interconnection parasitic parameters. Present AiP solutions using FOWLP technology generally form antenna pattern on Redistribution Layer, which brings design inconvenience. In our work, a low-cost PCB antenna with relatively large size is integrated, forms three-dimensional stacked structure. The AiP employs right angle transition board embedded in Epoxy molding compound (EMC), which transmits mm-wave signal to the substrate-integrated waveguide (SIW) antenna stacked on the back of EMC. The SIW antenna consists of 4x4 radiation slots with modified magnetoelectric dipole for bandwidth enhancement. Measured gain is 14dBi at 60GHz with bandwidth beyond 55-65GHz. The SIW antenna works also as heat sink, no extra thermal design is needed for 0.5W power consumption. The AiP module is manufactured and measured on circuit board. The proposed approach is a convenient solution for wide band and high gain millimeter wave AiP system integration.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":null,"pages":null},"PeriodicalIF":2.2000,"publicationDate":"2023-02-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4056991","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

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Abstract

The technology of fan-out wafer level packaging (FOWLP) has been widely adopted for millimeter wave Antenna-in-Package (AiP) system integration with low interconnection parasitic parameters. Present AiP solutions using FOWLP technology generally form antenna pattern on Redistribution Layer, which brings design inconvenience. In our work, a low-cost PCB antenna with relatively large size is integrated, forms three-dimensional stacked structure. The AiP employs right angle transition board embedded in Epoxy molding compound (EMC), which transmits mm-wave signal to the substrate-integrated waveguide (SIW) antenna stacked on the back of EMC. The SIW antenna consists of 4x4 radiation slots with modified magnetoelectric dipole for bandwidth enhancement. Measured gain is 14dBi at 60GHz with bandwidth beyond 55-65GHz. The SIW antenna works also as heat sink, no extra thermal design is needed for 0.5W power consumption. The AiP module is manufactured and measured on circuit board. The proposed approach is a convenient solution for wide band and high gain millimeter wave AiP system integration.

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采用扇出技术的高增益宽带封装天线解决方案

扇出晶圆级封装技术(FOWLP)已被广泛应用于毫米波封装天线(AiP)系统集成中，具有低互连寄生参数。目前采用FOWLP技术的AiP方案一般在重分发层形成天线方向图，给设计带来不便。在我们的工作中，集成了一个相对大尺寸的低成本PCB天线，形成三维堆叠结构。AiP采用嵌入环氧模复合材料的直角过渡板，将毫米波信号传输到堆叠在EMC背面的基片集成波导(SIW)天线。SIW天线由4 × 4辐射槽和改进的磁电偶极子组成，用于带宽增强。60GHz时的测量增益为14dBi，带宽超过55-65GHz。SIW天线也可以作为散热片，不需要额外的散热设计，功耗为0.5W。AiP模块是在电路板上制造和测量的。该方法为宽带高增益毫米波AiP系统集成提供了方便的解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Electronic Packaging 工程技术-工程：电子与电气

CiteScore

4.90

自引率

6.20%

发文量

审稿时长

3 months

期刊介绍： The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.