{"title":"A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules","authors":"Feifei Yan, Laili Wang, Yongmei Gan, Kaixuan Li, Boya Zhang","doi":"10.1115/1.4053891","DOIUrl":null,"url":null,"abstract":"\n The blocking voltage level of silicon carbide (SiC) can reach 10 to 25 kV, which will significantly increase the power density and capacity of power modules. However, high voltage can induce high electric field, increase the risk of partial discharge (PD) and threaten the insulation reliability. This paper focuses on the triple points between the metal electrode, silicone gel, and ceramic in power modules. The influencing factors of electric field at different triple points are fully analyzed. PD experiments are performed and the results show that interface between silicone gel and ceramic is a weak area of insulation. Therefore, this paper demonstrates that area of weak insulation and high electric field meet at the triple point. To solve this problem, a new structure of ceramic substrate is proposed, which isolates the interface area from high electric field. At the same time, the new structure can significantly reduce the high electric field reinforcement.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":2.3000,"publicationDate":"2022-02-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4053891","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 2
Abstract
The blocking voltage level of silicon carbide (SiC) can reach 10 to 25 kV, which will significantly increase the power density and capacity of power modules. However, high voltage can induce high electric field, increase the risk of partial discharge (PD) and threaten the insulation reliability. This paper focuses on the triple points between the metal electrode, silicone gel, and ceramic in power modules. The influencing factors of electric field at different triple points are fully analyzed. PD experiments are performed and the results show that interface between silicone gel and ceramic is a weak area of insulation. Therefore, this paper demonstrates that area of weak insulation and high electric field meet at the triple point. To solve this problem, a new structure of ceramic substrate is proposed, which isolates the interface area from high electric field. At the same time, the new structure can significantly reduce the high electric field reinforcement.
期刊介绍：
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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