Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2022-01-26 DOI:10.1115/1.4053642
Hayden Carlton, A. Iradukunda, D. Huitink, Sarah Myane, Noah Akey, Asif Imran Emon, Fang Luo
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引用次数: 1

Abstract

As power densities and switching frequencies dramatically increase in wide bandgap power electronics, EMI increasingly impacts power conversion efficiency and reliability, which requires mitigation for effective operation. Herein, we propose a nanocomposite encapsulant created by directly incorporating magnetic iron oxide nanoparticles into a silicone matrix for the purpose EMI shielding. The addition of small amounts of particles to the silicone resulted in a 1.7 dBµV drop in EMI intensity; however, the addition of the iron oxide reduced the dielectric breakdown strength of the silicone matrix by 83% with respect to concentration. Further efforts to optimize the dielectric properties of the nanocomposites with respect to the nanoparticle loading is necessary to directly apply this technology; yet the results indicate magnetic nanocomposites could be a potential avenue towards mitigating EMI in power devices.
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用于电力电子电磁干扰屏蔽的多功能磁性纳米复合密封剂
随着宽带隙功率电子器件中功率密度和开关频率的急剧增加,EMI对功率转换效率和可靠性的影响越来越大,这需要缓解才能有效运行。在此,我们提出了一种纳米复合封装剂,通过将磁性氧化铁纳米颗粒直接掺入硅树脂基体中来实现EMI屏蔽。向硅酮中添加少量颗粒导致EMI强度下降1.7dBµV;然而,氧化铁的加入使硅树脂基体的介电击穿强度相对于浓度降低了83%。为了直接应用该技术,需要进一步努力优化纳米复合材料相对于纳米颗粒负载的介电性能;然而研究结果表明,磁性纳米复合材料可能是减轻电力设备EMI的潜在途径。
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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