Fabrication of Three-Dimensional Piezoelectric Ceramics Using the Dispenser System

Shuto Matsuda, T. Fujii, N. Nakada, T. Karaki, T. Kakuda
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引用次数: 1

Abstract

We fabricated lead-free (K,Na,Li)NbO3 (KNLN) and BaTiO3 (BT) piezoelectric ceramics using a dispenser system. After dissolving polyvinyl butyral in ethanol, a paste for extrusion was fabricated by mixing KNLN or BT ceramic powders. After several times of paste extrusion with a dispenser system, degreasing was performed at 650°C. The KNLN moldings were sintered, at 1,100–1,170°C, and sintering of BT moldings were performed by two-step sintering at 1,320°C and 1,150°C. From the x-ray diffraction pattern, the fabricated KNLN ceramics had a perovskite structure. The density of the KNLN and BT moldings fabricated by the dispenser system was 3.94 and 5.42 g/cm3, respectively. In addition, the BT moldings had the dielectric constant εr = 1.95 × 103. The Curie temperature of the BT moldings was confirmed at about 125°C, as with the BT piezoelectric ceramics fabricated by uniaxial pressure molding. The BT moldings had the piezoelectric constant d33 = 60 pC/N. The fabrication methods studied in this work provided the potential to fabricate simple three-dimensional piezoelectric ceramic devices for applications in acoustic wave sensors.
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利用点胶系统制备三维压电陶瓷
我们利用点胶系统制备了无铅(K,Na,Li)NbO3 (KNLN)和BaTiO3 (BT)压电陶瓷。在乙醇中溶解聚乙烯醇丁醛后,将KNLN或BT陶瓷粉末混合制成挤出膏体。经过几次膏体挤出与分配系统,脱脂在650°C进行。KNLN模具在1100 ~ 1170℃下烧结,BT模具在1320℃和1150℃下进行两步烧结。从x射线衍射图来看,制备的KNLN陶瓷具有钙钛矿结构。该点胶系统制备的KNLN和BT的密度分别为3.94和5.42 g/cm3。此外,BT模的介电常数εr = 1.95 × 103。与单轴压成型制备的BT压电陶瓷一样,BT成型的居里温度约为125℃。BT模的压电常数d33 = 60 pC/N。本文所研究的制作方法为制作简单的三维压电陶瓷器件提供了潜力,该器件可用于声波传感器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering
CiteScore
1.30
自引率
0.00%
发文量
5
期刊介绍: The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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