Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission Property
Masaya Toba, S. Nomoto, Nobuhito Komuro, Kazuyuki Mitsukura, S. Abe, T. Masuko, Kazuhiko Kurafuchi
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Abstract
Abstract Semiconductor packages for high-performance devices with printed circuit boards having multiwiring layers such as flip-chip ball grid array have been attracting the attention to realize ul...
期刊介绍：
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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