Ling Du , Yu-Feng Guo , Jun Zhang , Jia-Fei Yao , Jian-Hua Liu , Chen-Yang Huang , Man Li
{"title":"3-D analytical model of the high-voltage interconnection effect for SOI LDMOS","authors":"Ling Du , Yu-Feng Guo , Jun Zhang , Jia-Fei Yao , Jian-Hua Liu , Chen-Yang Huang , Man Li","doi":"10.1016/j.spmi.2021.107056","DOIUrl":null,"url":null,"abstract":"<div><p><span>The high-voltage interconnection (HVI) effect induces electric field crowding at the drift region near the source side of power lateral double diffusion MOS (LDMOS). Thus, the electric field profile is deteriorated, and the breakdown characteristic is weakened. This increases the difficulty of device optimization and affects the reliability of the device significantly. Since conventional models based 2-D method can only treat the HVI as a metal layer, therefore, no quantitative analysis can be provided. In order to quantify the impact of the HVI and provide a design scheme for preventing the deterioration in the device's breakdown characteristic, a novel three-dimensional analytical model of the HVI effect for the </span>SOI<span> LDMOS is proposed. By solving the 3-D Poisson's equation, the potential and electric field distribution of the drift region surface are investigated, and the breakdown mechanism is explored quantitatively. The analytical solutions are matched well with the simulation results, which verify the validity of the model. Based on the model, a simple and effective criterion is derived to optimize the structure geometry parameters. The largest width of the HVI metal line is given to prevent the breakdown voltage deterioration.</span></p></div>","PeriodicalId":22044,"journal":{"name":"Superlattices and Microstructures","volume":null,"pages":null},"PeriodicalIF":3.3000,"publicationDate":"2021-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Superlattices and Microstructures","FirstCategoryId":"101","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0749603621002548","RegionNum":3,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"PHYSICS, CONDENSED MATTER","Score":null,"Total":0}
引用次数: 0
Abstract
The high-voltage interconnection (HVI) effect induces electric field crowding at the drift region near the source side of power lateral double diffusion MOS (LDMOS). Thus, the electric field profile is deteriorated, and the breakdown characteristic is weakened. This increases the difficulty of device optimization and affects the reliability of the device significantly. Since conventional models based 2-D method can only treat the HVI as a metal layer, therefore, no quantitative analysis can be provided. In order to quantify the impact of the HVI and provide a design scheme for preventing the deterioration in the device's breakdown characteristic, a novel three-dimensional analytical model of the HVI effect for the SOI LDMOS is proposed. By solving the 3-D Poisson's equation, the potential and electric field distribution of the drift region surface are investigated, and the breakdown mechanism is explored quantitatively. The analytical solutions are matched well with the simulation results, which verify the validity of the model. Based on the model, a simple and effective criterion is derived to optimize the structure geometry parameters. The largest width of the HVI metal line is given to prevent the breakdown voltage deterioration.
期刊介绍:
Micro and Nanostructures is a journal disseminating the science and technology of micro-structures and nano-structures in materials and their devices, including individual and collective use of semiconductors, metals and insulators for the exploitation of their unique properties. The journal hosts papers dealing with fundamental and applied experimental research as well as theoretical studies. Fields of interest, including emerging ones, cover:
• Novel micro and nanostructures
• Nanomaterials (nanowires, nanodots, 2D materials ) and devices
• Synthetic heterostructures
• Plasmonics
• Micro and nano-defects in materials (semiconductor, metal and insulators)
• Surfaces and interfaces of thin films
In addition to Research Papers, the journal aims at publishing Topical Reviews providing insights into rapidly evolving or more mature fields. Written by leading researchers in their respective fields, those articles are commissioned by the Editorial Board.
Formerly known as Superlattices and Microstructures, with a 2021 IF of 3.22 and 2021 CiteScore of 5.4