{"title":"Equivalent Capacitance Approach to Calculate Effective Roughness Dielectric Parameters for Copper Foils on Printed Circuit Boards","authors":"M. Koledintseva, T. Vincent","doi":"10.4071/IMAPS.654479","DOIUrl":null,"url":null,"abstract":"Effective roughness dielectric (ERD) is a homogeneous lossy dielectric layer of certain thickness with effective (averaged) dielectric parameters. The ERD layer is used to model copper foil roughness in printed circuit board interconnects by being placed on a smooth conductor surface to substitute an inhomogeneous transition layer between a conductor and laminate substrate dielectric. This work derives the ERD parameters based on the understanding that there is a gradual variation of concentration of metallic inclusions in the transition layer between the dielectric and foil. The gradual variation can be structured as thin layers that are obtained using the equivalent capacitance approach. The concentration profile is extracted from scanning electron microscopy or high-resolution optical microscopy. As the concentration of metallic particles increases along the axis normal to the laminate dielectric and foil boundary, two regions can be discerned: an insulating (prepercolation) region and a conducting (pe...","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":"15 1","pages":"49-62"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/IMAPS.654479","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 1
Abstract
Effective roughness dielectric (ERD) is a homogeneous lossy dielectric layer of certain thickness with effective (averaged) dielectric parameters. The ERD layer is used to model copper foil roughness in printed circuit board interconnects by being placed on a smooth conductor surface to substitute an inhomogeneous transition layer between a conductor and laminate substrate dielectric. This work derives the ERD parameters based on the understanding that there is a gradual variation of concentration of metallic inclusions in the transition layer between the dielectric and foil. The gradual variation can be structured as thin layers that are obtained using the equivalent capacitance approach. The concentration profile is extracted from scanning electron microscopy or high-resolution optical microscopy. As the concentration of metallic particles increases along the axis normal to the laminate dielectric and foil boundary, two regions can be discerned: an insulating (prepercolation) region and a conducting (pe...
期刊介绍:
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.