J. Lau, G. Chen, C. Yang, Vincet Teng, A. Peng, J. Huang, N. Liu, Y. Chen, TJ Tseng, Ming Li
{"title":"Hybrid Substrates For Heterogeneous Integration","authors":"J. Lau, G. Chen, C. Yang, Vincet Teng, A. Peng, J. Huang, N. Liu, Y. Chen, TJ Tseng, Ming Li","doi":"10.1115/1.4062993","DOIUrl":null,"url":null,"abstract":"\n The hybrid substrate (organic interposer + build-up package substrate + solder joints + underfill) of multiple systems and heterogeneous integration is investigated. The organic interposer of the hybrid substrate is fabricated by a fan-out chip-last on a temporary panel with two different kinds of dielectric materials, namely the PID (photoimageable dielectric) and the ABF (Ajinomoto Build-Up Film). These two hybrid substrates are supporting two different chips. The flatness of metal lines of the RDLs (redistribution-layers), the quality of the hybrid substrate after chip-to-hybrid substrate bonding, and the reliability of the solder joints between these two hybrid substrates will be discussed.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2023-07-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4062993","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 1
Abstract
The hybrid substrate (organic interposer + build-up package substrate + solder joints + underfill) of multiple systems and heterogeneous integration is investigated. The organic interposer of the hybrid substrate is fabricated by a fan-out chip-last on a temporary panel with two different kinds of dielectric materials, namely the PID (photoimageable dielectric) and the ABF (Ajinomoto Build-Up Film). These two hybrid substrates are supporting two different chips. The flatness of metal lines of the RDLs (redistribution-layers), the quality of the hybrid substrate after chip-to-hybrid substrate bonding, and the reliability of the solder joints between these two hybrid substrates will be discussed.
期刊介绍：
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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