{"title":"Parametric Effects On Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review","authors":"Tolga Emir, H. Ourabi, M. Budakli, M. Arik","doi":"10.1115/1.4054184","DOIUrl":null,"url":null,"abstract":"\n Pool boiling heat transfer offers high-performance cooling opportunities for thermal problems of electronics limited with high heat fluxes. Therefore, many researchers have been extensively studying over the last six decades. This paper presents a critical literature review of various parametric effects on pool boiling heat transfer and CHF such as pressure, subcooling, surface topography, surface orientation, working fluid, and combined effects. To achieve an optimal heat removal solution for a particular problem, each of these parameters must be understood. The governing mechanisms are discussed separately, and various options related to the selection of appropriate working fluids are highlighted. A broad summary of correlations developed until now for predicting critical heat flux (CHF) is presented with their ranges of validity. While proposed correlations for predicting CHF has been quite promising, they still have a considerable uncertainty (±25%). Finally, a correlation proposed by Professor Avram Bar-Cohen and his team (TME correlation) is compared with the experimental data set published in previous studies. It shows that the uncertainty band can be further narrowed down to ±12.5% for dielectric liquids by using TME correlation. Furthermore, this correlation has been enhanced to predict CHF values underwater above 50 W/cm2 by applying a genetic algorithm, and new perspectives for possible future research activities are proposed.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2022-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4054184","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 2
Abstract
Pool boiling heat transfer offers high-performance cooling opportunities for thermal problems of electronics limited with high heat fluxes. Therefore, many researchers have been extensively studying over the last six decades. This paper presents a critical literature review of various parametric effects on pool boiling heat transfer and CHF such as pressure, subcooling, surface topography, surface orientation, working fluid, and combined effects. To achieve an optimal heat removal solution for a particular problem, each of these parameters must be understood. The governing mechanisms are discussed separately, and various options related to the selection of appropriate working fluids are highlighted. A broad summary of correlations developed until now for predicting critical heat flux (CHF) is presented with their ranges of validity. While proposed correlations for predicting CHF has been quite promising, they still have a considerable uncertainty (±25%). Finally, a correlation proposed by Professor Avram Bar-Cohen and his team (TME correlation) is compared with the experimental data set published in previous studies. It shows that the uncertainty band can be further narrowed down to ±12.5% for dielectric liquids by using TME correlation. Furthermore, this correlation has been enhanced to predict CHF values underwater above 50 W/cm2 by applying a genetic algorithm, and new perspectives for possible future research activities are proposed.
期刊介绍:
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.