Parametric Effects On Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2022-03-24 DOI:10.1115/1.4054184
Tolga Emir, H. Ourabi, M. Budakli, M. Arik
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引用次数: 2

Abstract

Pool boiling heat transfer offers high-performance cooling opportunities for thermal problems of electronics limited with high heat fluxes. Therefore, many researchers have been extensively studying over the last six decades. This paper presents a critical literature review of various parametric effects on pool boiling heat transfer and CHF such as pressure, subcooling, surface topography, surface orientation, working fluid, and combined effects. To achieve an optimal heat removal solution for a particular problem, each of these parameters must be understood. The governing mechanisms are discussed separately, and various options related to the selection of appropriate working fluids are highlighted. A broad summary of correlations developed until now for predicting critical heat flux (CHF) is presented with their ranges of validity. While proposed correlations for predicting CHF has been quite promising, they still have a considerable uncertainty (±25%). Finally, a correlation proposed by Professor Avram Bar-Cohen and his team (TME correlation) is compared with the experimental data set published in previous studies. It shows that the uncertainty band can be further narrowed down to ±12.5% for dielectric liquids by using TME correlation. Furthermore, this correlation has been enhanced to predict CHF values underwater above 50 W/cm2 by applying a genetic algorithm, and new perspectives for possible future research activities are proposed.
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参数对池沸腾传热和临界热流密度的影响
池沸腾传热为受高热通量限制的电子器件的热问题提供了高性能的冷却机会。因此,在过去的60年里,许多研究人员进行了广泛的研究。本文对压力、过冷度、表面形貌、表面取向、工作流体和组合效应等对池沸腾传热和CHF的各种参数影响进行了批判性文献综述。为了实现特定问题的最佳散热解决方案,必须了解这些参数中的每一个。分别讨论了控制机制,并强调了与选择合适的工作流体相关的各种选择。对迄今为止为预测临界热通量(CHF)而开发的相关性及其有效范围进行了广泛总结。虽然所提出的预测CHF的相关性非常有希望,但它们仍有相当大的不确定性(±25%)。最后,将Avram Bar-Cohen教授及其团队提出的相关性(TME相关性)与先前研究中发表的实验数据集进行了比较。结果表明,利用TME相关性可以将介质液体的不确定度带进一步缩小到±12.5%。此外,通过应用遗传算法,增强了这种相关性,可以预测50 W/cm2以上的水下CHF值,并为未来可能的研究活动提出了新的前景。
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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