Recent Advances and Trends in Heterogeneous Integrations

Abstract

The recent advances and trends in heterogeneous integrations are presented in this study. Emphasis is placed on: (A) the definition of heterogeneous integrations, (B) the classifications of heterogeneous integrations such as heterogeneous integrations on (a) organic substrates, (b) silicon substrates (through-silicon via interposers), (c) silicon substrates (bridges), (d) fan-out RDL (redistribution-layer) substrates, and (e) ceramic substrates, and (C) the examples of heterogeneous integrations of chip-to-chip, chip-to-wafer, memory stacks, package-on-package, light-emitting diode, CMOS image sensors, microelectro-mechanical systems, vertical-cavity surface-emitting laser, and photodetector. The trends of heterogeneous integrations are also presented.