Understanding Thermal Lagging Behaviors in Thermoelectric Elements with the Dual-Phase-Lag Model

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2021-11-08 DOI:10.1115/1.4052948
W. Yeung, T. Lam
{"title":"Understanding Thermal Lagging Behaviors in Thermoelectric Elements with the Dual-Phase-Lag Model","authors":"W. Yeung, T. Lam","doi":"10.1115/1.4052948","DOIUrl":null,"url":null,"abstract":"\n This study investigates the heat transport mechanism in semiconductor elements within a homogeneous thermoelectric cooling system using the dual-phase-lag model. The thermal lagging behavior is analyzed and explored during the energy transport process. The coupled energy and constitutive partial differential equations are solved simultaneously to reduce the complexity of the high-order spatial and time derivatives. This approach simplifies the mathematical solution process and reduces numerical instabilities when compared to the conventional methodology in which either the temperature or heat flux are solved individually with a single equation. The effect of the thermal lagging behavior on energy transport is examined and compared to results by using the Cattaneo-Vernotte model. Furthermore, the phase-lag behavior on the temperature and heat flux profiles are investigated in detail. This study provides perceptive information for engineering applications in which microscale heat transport phenomenon plays a significant role during the design process. Adding the dual-phase-lag model to the traditional heat diffusion model will be a complementary option for engineers in the thermoelectric industry.","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2021-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4052948","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

This study investigates the heat transport mechanism in semiconductor elements within a homogeneous thermoelectric cooling system using the dual-phase-lag model. The thermal lagging behavior is analyzed and explored during the energy transport process. The coupled energy and constitutive partial differential equations are solved simultaneously to reduce the complexity of the high-order spatial and time derivatives. This approach simplifies the mathematical solution process and reduces numerical instabilities when compared to the conventional methodology in which either the temperature or heat flux are solved individually with a single equation. The effect of the thermal lagging behavior on energy transport is examined and compared to results by using the Cattaneo-Vernotte model. Furthermore, the phase-lag behavior on the temperature and heat flux profiles are investigated in detail. This study provides perceptive information for engineering applications in which microscale heat transport phenomenon plays a significant role during the design process. Adding the dual-phase-lag model to the traditional heat diffusion model will be a complementary option for engineers in the thermoelectric industry.
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用双相滞后模型理解热电元件的热滞后行为
本文利用双相滞后模型研究了均匀热电冷却系统中半导体元件的热传递机制。对能量输运过程中的热滞后行为进行了分析和探讨。同时求解耦合能量方程和本构偏微分方程,降低了高阶空间导数和时间导数的复杂性。该方法简化了数学求解过程,并减少了数值不稳定性,而传统的方法是用单个方程单独求解温度或热流。研究了热滞后行为对能量输运的影响,并与Cattaneo-Vernotte模型的结果进行了比较。此外,还详细研究了相位滞后对温度和热流分布的影响。该研究为工程应用提供了感性信息,其中微尺度热传递现象在设计过程中起着重要作用。将双相滞后模型添加到传统的热扩散模型中,将成为热电行业工程师的补充选择。
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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