{"title":"Moisture-Resistant Sealing Materials for Downhole HPHT Electrical Feedthrough Package","authors":"Hua Xia, N. Settles, David DeWire","doi":"10.4071/IMAPS.942864","DOIUrl":null,"url":null,"abstract":"\n A bismuth oxide–based multicomponent glass system, xH3BO3-yBi2O3-(1-x-y-δ)MO-δ· rare earth oxides (REOs) with MO = TiO2, BaO, ZnO, Fe2O3, etc., and lanthanum series–based REOs, for making downhole high-pressure and high-temperature electrical feedthrough package has been developed using high-temperature melt-quenching and sintering technologies. By properly controlling phase structures in material-manufacturing processes, the obtained sealing materials have shown moisture-resistant properties in their monoclinic and tetragonal mixed phase structures but strongly hydrophobic properties in their covalent bond tetragonal phase. Sealed electrical feedthrough packages have been evaluated under boiling water immersion and 200°C/30,000 PSI water-fluid–simulated downhole harsh environments. The post electrical insulation measurement has demonstrated to be greater than 1.0 × 1014 Ω electrical resistance. This article will show that such a high–bonding strength and high–insulation strength sealing material could be used to seal electrical feed-throughs and connectors for 300°C/30,000 PSI downhole and subsea wireline, logging while drilling, and measurement while drilling tools' signal, data, and electrical power transmissions.","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/IMAPS.942864","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 1
Abstract
A bismuth oxide–based multicomponent glass system, xH3BO3-yBi2O3-(1-x-y-δ)MO-δ· rare earth oxides (REOs) with MO = TiO2, BaO, ZnO, Fe2O3, etc., and lanthanum series–based REOs, for making downhole high-pressure and high-temperature electrical feedthrough package has been developed using high-temperature melt-quenching and sintering technologies. By properly controlling phase structures in material-manufacturing processes, the obtained sealing materials have shown moisture-resistant properties in their monoclinic and tetragonal mixed phase structures but strongly hydrophobic properties in their covalent bond tetragonal phase. Sealed electrical feedthrough packages have been evaluated under boiling water immersion and 200°C/30,000 PSI water-fluid–simulated downhole harsh environments. The post electrical insulation measurement has demonstrated to be greater than 1.0 × 1014 Ω electrical resistance. This article will show that such a high–bonding strength and high–insulation strength sealing material could be used to seal electrical feed-throughs and connectors for 300°C/30,000 PSI downhole and subsea wireline, logging while drilling, and measurement while drilling tools' signal, data, and electrical power transmissions.
期刊介绍:
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.