Comparison Study of DBD Plasma Combined with E-Beam Pre- and Post-treatment on the Structural-Property Improvement of Chinese Yam Starch

IF 5.3 2区 农林科学 Q1 FOOD SCIENCE & TECHNOLOGY Food and Bioprocess Technology Pub Date : 2023-03-23 DOI:10.1007/s11947-023-03024-1
Wei Liang, Xinyue Liu, Jiayu Zheng, Wenqing Zhao, Yue Zheng, Xiangzhen Ge, Huishan Shen, Gulnazym Ospankulova, Marat Muratkhan, Kakimova Zhainagul Kh, Wenhao Li
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引用次数: 1

Abstract

The study is aimed at investigating the effect of dielectric barrier discharge (DBD) plasma and E-beam technology modification sequences on the “structure property” of starch. Here, DBD plasma (treated with 1 and 5 min) and E-beam (irradiated under 5 and 10 kGy) and their pre-/post dual modifications were applied to characterize the structural and physicochemical properties of starch. Although plasma causes etching on the starch surface, E-beam poses a minor effect on microstructure. Both modifications promoted starch degradation, resulting in substantial molecular weight, long chain proportions, and viscosity reductions. Also, the short-range ordered structure and the relative crystallinity of starch were disrupted after both modifications. Nevertheless, starch FT-IR spectrum patterns, crystal types, and growth rings were retained. In addition, both treatments improved native starch solubility and suppressed swelling power. Interestingly, plasma-E-beam (P-E) treatment induced a deeper modification degree of starch at the same treatment intensity than E-beam-plasma (E-P) treatment, as evidenced by lower molecular weight and viscosity, smaller R1047/1024, and enthalpy. For resistant starch (RS) content, P-E treatment provided a more intensive improvement. Consequentlys, we suggest pre-plasma treatment in starch processing since it improves the viscosity, solubility, and digestibility of native starch with less damage to the starch structure.

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DBD等离子体联合电子束前后处理对山药淀粉结构性能改善的比较研究
研究了介质阻挡放电(DBD)等离子体和电子束技术修饰序列对淀粉“结构性能”的影响。本研究采用DBD等离子体(1和5分钟)和电子束(5和10千吉照射)及其前后双重修饰来表征淀粉的结构和物理化学性质。等离子体对淀粉表面有腐蚀作用,电子束对淀粉的微观结构影响较小。这两种改性都促进了淀粉的降解,导致大量的分子量、长链比例和粘度降低。两种改性均破坏了淀粉的短期有序结构和相对结晶度。然而,淀粉的FT-IR光谱模式、晶体类型和生长环被保留了下来。此外,两种处理都提高了天然淀粉的溶解度,抑制了溶胀力。有趣的是,在相同的处理强度下,等离子体-电子束(P-E)处理比电子束-等离子体(E-P)处理诱导淀粉的改性程度更深,表现为更低的分子量和粘度,更小的R1047/1024和焓。对于抗性淀粉(RS)含量,P-E处理提供了更显著的改善。因此,我们建议在淀粉加工中采用等离子体前处理,因为它可以提高天然淀粉的粘度、溶解度和消化率,同时对淀粉结构的破坏较小。
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来源期刊
Food and Bioprocess Technology
Food and Bioprocess Technology 农林科学-食品科技
CiteScore
9.50
自引率
19.60%
发文量
200
审稿时长
2.8 months
期刊介绍: Food and Bioprocess Technology provides an effective and timely platform for cutting-edge high quality original papers in the engineering and science of all types of food processing technologies, from the original food supply source to the consumer’s dinner table. It aims to be a leading international journal for the multidisciplinary agri-food research community. The journal focuses especially on experimental or theoretical research findings that have the potential for helping the agri-food industry to improve process efficiency, enhance product quality and, extend shelf-life of fresh and processed agri-food products. The editors present critical reviews on new perspectives to established processes, innovative and emerging technologies, and trends and future research in food and bioproducts processing. The journal also publishes short communications for rapidly disseminating preliminary results, letters to the Editor on recent developments and controversy, and book reviews.
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