Ryosuke Noro, Mariko Adachi, Yasufumi Fujiwara, M. Uemukai, T. Tanikawa, R. Katayama
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引用次数: 0
Abstract
GaN is an attractive material for integrating optical quantum devices. Adding a large optical nonlinearity of MgO doped congruent LiNbO3 (MgO:CLN) to GaN will improve the efficiency of quantum light sources. In this work, we proposed transverse quasi-phase-matched wavelength conversion devices with waveguide core materials of MgO:CLN and GaN. The waveguide core is formed by an adhesion-free surface activated bonding (SAB). A high thin film transfer yield was achieved with a high bonding strength of 4 MPa by optimizing the bonding conditions and reducing the surface roughness of the GaN film to be 0.5 nm in a 100 × 100 μm2 area using chemical mechanical polishing. The MgO:CLN/GaN waveguide structure was successfully fabricated by MgO:CLN thin film transfer, lift-off and dry etching processes. This MgO:CLN/GaN adhesion-free SAB technique is expected to be applied to various devices, such as optical devices and electronic devices, to enhance their functionality.
期刊介绍:
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS