Effect of nitrile-functionalization and thermal cross-linking on the dielectric and mechanical properties of PEN/CNTs–CN composites

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2013-03-24 DOI:10.1007/s10854-013-1190-6
Zejun Pu, Xu Huang, Lan Chen, Jian Yang, Hailong Tang, Xiaobo Liu
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引用次数: 17

Abstract

In this study, a novel series of composite films consisting of nitrile-functionalized carbon nanotubes (CNTs–CN) and poly(arylene ether nitriles) (PEN) were successfully fabricated by the tape-casting method. The –CN groups in PEN chains and the phthalonitrile groups on CNTs–CN formed the thermally stable triazine rings by thermal cross-linking reaction in the presence of diamino diphenyl sulfone, which was characterized by Fourier transform infrared spectroscopy. The result indicated that the chemical cross-linking reaction occurred accompanied by the emergence of a new absorption peak at 1,361?cm?1. Besides, the effect of cross-linking on the morphology, thermal stability, mechanical and dielectric properties of the PEN/CNTs–CN was investigated. The SEM images showed that the phase interface between surface modified CNTs and PEN matrix was indistinct, and the surface modified CNTs presented a better dispersion behavior in PEN matrix. The mechanical properties of the processed films were improved substantially compared with the unprocessed films. Furthermore, the glass-transition temperature (T g ) of composite films processed at 320?°C for 4?h (about 245?°C) was higher than that of composite films before thermal treatment (about 205?°C). The 5?% weight loss temperature of the composite films (processed at 320?°C for 4?h) increased by about 110?°C compared with the composite films (unprocessed). More importantly, by thermal cross-linking, the dielectric constant (ε) of composite films with 8?wt% CNTs–CN loading was increased from 31.8 to 33.9, and dielectric loss (tan δ) was decreased from 0.90 to 0.61 at 1?kHz.

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腈基功能化和热交联对PEN/ CNTs-CN复合材料介电性能和力学性能的影响
在本研究中,采用带铸法制备了一种由腈基功能化碳纳米管(CNTs-CN)和聚芳醚腈(PEN)组成的新型复合薄膜。在二氨基二苯砜的存在下,PEN链上的-CN基团与CNTs-CN上的邻苯腈基团通过热交联反应形成热稳定的三嗪环,并用傅里叶变换红外光谱对其进行了表征。结果表明,化学交联反应发生的同时,在1361 ?cm?1处出现了新的吸收峰。此外,还研究了交联对PEN/ CNTs-CN的形貌、热稳定性、力学性能和介电性能的影响。SEM图像显示,表面改性CNTs与PEN基体的相界面不清晰,表面改性CNTs在PEN基体中表现出较好的分散行为。与未处理薄膜相比,处理后的薄膜的力学性能有了很大的提高。此外,在320℃下加工的复合膜的玻璃化转变温度(T g)摄氏4度h(约245°C)高于热处理前复合膜(约205°C)。5吗?复合薄膜的失重温度(在320?°C, 4h)增加约110°C。°C与复合膜(未处理)相比。更重要的是,通过热交联,复合膜的介电常数ε (8?wt% CNTs-CN负载从31.8增加到33.9,介电损耗(tan δ)从0.90降低到0.61。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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