Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders

Memories - Materials, Devices, Circuits and Systems Pub Date : 2023-07-01 DOI:10.1016/j.memori.2023.100026

Gui-sheng Gan , Tian Huang , Shi-qi Chen , Liu-jie Jiang , Da-yong Cheng , Shu-ye Zhang

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引用次数: 3

Abstract

Composite solders of $1 μ m$ Zn particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of $25 \sim 38 μ m$ was used to achieve micro-joining of Cu/Cu under ultrasonic-assisted at 180 °C, and aging at 125 °C was used to strengthen Cu/Cu joints. The results showed that interface intermetallic compounds (IMCs) between Cu substrates and solder were mainly smooth Cu₅Zn₈, and the Zn–Sn–Cu phase was formed to complete interconnection between SAC0307 particles at 180 °C. With the increase of aging time, the shear strength of joints first increased and reached a peak value of 36.26MPa at 2h which was 21.8% higher than that of the as-received joints, then the shear strength decreased and tended to be stable at 24h which was increased by 10.0% compared with that of the as-received joints.

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SAC颗粒钎料Cu/Cu接头的低温互连及强化机理

使用1μm Zn颗粒和粒径为25～38μm的Sn-0.3Ag-0.7Cu（SAC0307）的复合焊料在180°C的超声辅助下实现Cu/Cu的微连接，并使用125°C的时效来增强Cu/Cu接头。结果表明，Cu衬底与焊料之间的界面金属间化合物（IMCs）主要是光滑的Cu5Zn8，并且在180°C下形成Zn–Sn–Cu相以完成SAC0307颗粒之间的互连。随着老化时间的增加，接头的抗剪强度首先增加，在2h时达到峰值36.26MPa，比收到的接头高21.8%，然后在24h时抗剪强度下降并趋于稳定，与收到的接头相比提高了10.0%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Memories - Materials, Devices, Circuits and Systems

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