{"title":"A smart power transistor for high voltage inverter applications","authors":"Rupprecht Gabriel","doi":"10.1016/0026-2692(93)90101-J","DOIUrl":null,"url":null,"abstract":"<div><p>Motors, lighting equipment and power supplied benefit from high voltage smart power integrated circuits. Limitations of standard isolation techniques in respect of reverse operation in inductive load applications, i.e. high <span><math><mtext>d</mtext><mtext>V/</mtext><mtext>d</mtext><mtext>t</mtext></math></span> load, cause standard isolation techniques to fail in these applications. Dielectric isolation techniques are overcoming these problems. This paper describes a new concept for high voltage power integrated circuits using silicon on insulator (SOI) technology in high voltage smart power transistors.</p><p>SOI technology enables the integration of vertical power transistors and smart power features such as gate drive, overcurrent and overtemperature shutdown circuitry. Using dielectric isolation techniques, virtually all power transistor families and integrated circuits technologies can be merged. The benefits and limitations of this technology are discussed in connection with a high voltage smart power MOS transistor and an IGBT using SOI technology.</p></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"24 1","pages":"Pages 55-60"},"PeriodicalIF":1.9000,"publicationDate":"1993-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0026-2692(93)90101-J","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/002626929390101J","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 1
Abstract
Motors, lighting equipment and power supplied benefit from high voltage smart power integrated circuits. Limitations of standard isolation techniques in respect of reverse operation in inductive load applications, i.e. high load, cause standard isolation techniques to fail in these applications. Dielectric isolation techniques are overcoming these problems. This paper describes a new concept for high voltage power integrated circuits using silicon on insulator (SOI) technology in high voltage smart power transistors.
SOI technology enables the integration of vertical power transistors and smart power features such as gate drive, overcurrent and overtemperature shutdown circuitry. Using dielectric isolation techniques, virtually all power transistor families and integrated circuits technologies can be merged. The benefits and limitations of this technology are discussed in connection with a high voltage smart power MOS transistor and an IGBT using SOI technology.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.