Observation and characterization of near-interface oxide traps in 3C-SiC MOS structures by quasi-static I–V method

IF 1.4 4区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Solid-state Electronics Pub Date : 2011-09-01 DOI:10.1016/j.sse.2011.04.015
A. Constant, P. Godignon
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引用次数: 2

Abstract

The electrical properties of oxides grown on 3C-SiC by rapid thermal processing in various oxidizing and annealing atmospheres are investigated using a quasi-static method. According to the anomalous capacitance hump, the existence of two types of traps, interface and near interface oxide traps, is observed in quasi-static. By monitoring the sweep-rate measurement of the quasi-static current related to electron tunneling from interface traps to near-interface oxide traps, a profile of the traps in response time can be obtained. Based on the extracted parameters of the carrier traps, we demonstrate that the near SiO2/3C-SiC interface is significantly improved when using 100% N2O compared to 100% O2 or even N2–O2 dilution as oxidizing gas. Also, we show that incorporating N2 during the oxidation in O2 is not favourable for the reduction of the near-interface oxide traps.

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准静态I-V法观察和表征3C-SiC MOS结构中近界面氧化阱
采用准静态方法研究了在不同氧化和退火气氛下快速热处理在3C-SiC上生长的氧化物的电学性能。根据异常电容驼峰,在准静态条件下观察到界面氧化物陷阱和近界面氧化物陷阱两种类型的存在。通过监测与电子从界面陷阱到近界面氧化物陷阱隧穿相关的准静态电流的扫描速率测量,可以得到陷阱响应时间的分布图。基于提取的载流子陷阱参数,我们证明了当使用100%的N2O作为氧化气体时,与使用100%的O2甚至稀释的N2-O2相比,SiO2/3C-SiC附近的界面明显改善。此外,我们还表明,在O2氧化过程中加入N2不利于近界面氧化陷阱的还原。
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来源期刊
Solid-state Electronics
Solid-state Electronics 物理-工程:电子与电气
CiteScore
3.00
自引率
5.90%
发文量
212
审稿时长
3 months
期刊介绍: It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.
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