Enhanced Microstrip Guard Trace for Ringing Noise Suppression Using a Dielectric Superstrate

Yung-Shou Cheng, Wei-Da Guo, C. Hung, R. Wu, D. De Zutter
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引用次数: 26

Abstract

Grounded guard traces are increasingly used to reduce the coupling-induced crosstalk, but the incurred ringing noise will strongly limit the performance for the microstrip structures. This paper describes the generation mechanism of the ringing noise and derives an analytical formula of the noise magnitude. Besides, an enhanced microstrip guard trace design is proposed to eliminate the ringing noise by covering the original microstrip structure with a superstrate of higher permittivity. A design space versus the superstrate thickness and the dielectric constant are constructed and in which, the guard trace needs be grounded at the two ends only without causing any ringing noise. Finally, the time-domain simulations and experiments are performed to verify the proposed concept.
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利用介电层抑制振铃噪声的增强型微带保护走线
接地保护走线越来越多地用于减少耦合串扰,但产生的振铃噪声严重限制了微带结构的性能。本文阐述了振铃噪声的产生机理,推导出了振铃噪声幅值的解析公式。此外,提出了一种增强的微带保护走线设计,通过在原有微带结构上覆盖更高介电常数的层来消除振铃噪声。构建了一个与上层厚度和介电常数相对的设计空间,在该空间中,保护走线只需要在两端接地,而不会产生任何振铃噪声。最后,进行了时域仿真和实验来验证所提出的概念。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging 工程技术-材料科学:综合
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