{"title":"Foreword Special Section on Recent Progress in Electrical Modeling and Simulation of High-Speed ICs and Packages","authors":"D. Jiao","doi":"10.1109/TADVP.2010.2099155","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"758-759"},"PeriodicalIF":0.0000,"publicationDate":"2010-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2099155","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Advanced Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TADVP.2010.2099155","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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