A Homogeneous Electrically Conductive Silver Paste

Jianguo Liu, Yu Cao, Xiaoye Wang, J. Duan, Xiaoyan Zeng
{"title":"A Homogeneous Electrically Conductive Silver Paste","authors":"Jianguo Liu, Yu Cao, Xiaoye Wang, J. Duan, Xiaoyan Zeng","doi":"10.1109/TADVP.2010.2062182","DOIUrl":null,"url":null,"abstract":"A homogeneous electrically conductive silver paste was developed using silver i-propylcarbamate ((CH3)2CHNHCOOAg) as the precursor of functional phase. The precursor had good solubility in water and methanol, high silver content (about 50 wt.%) and low decomposition temperature (below 200 °C). The paste was a non-Newtonian fluid with the viscosity depending significantly on the content of thickening agent (ethyl cellulose). When the paste was applied in micro-pen direct-writing process, it was able to produce high-resolution (20 μm or so) array patterns. After a homogeneous paste with about 40 wt.% silver i-propylcarbamate as the precursor was directly written and sintered at 180 °C for 15 min, an electrically conductive network consisting of more than 95 wt.% silver was formed and the network had a volume electrical resistivity in the order of magnitude of 10-5-10-6 Ω · cm and a sheet electrical resistivity in the order of magnitude of 10-4 Ω/square.","PeriodicalId":55015,"journal":{"name":"IEEE Transactions on Advanced Packaging","volume":"33 1","pages":"899-903"},"PeriodicalIF":0.0000,"publicationDate":"2010-08-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TADVP.2010.2062182","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Advanced Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TADVP.2010.2062182","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

A homogeneous electrically conductive silver paste was developed using silver i-propylcarbamate ((CH3)2CHNHCOOAg) as the precursor of functional phase. The precursor had good solubility in water and methanol, high silver content (about 50 wt.%) and low decomposition temperature (below 200 °C). The paste was a non-Newtonian fluid with the viscosity depending significantly on the content of thickening agent (ethyl cellulose). When the paste was applied in micro-pen direct-writing process, it was able to produce high-resolution (20 μm or so) array patterns. After a homogeneous paste with about 40 wt.% silver i-propylcarbamate as the precursor was directly written and sintered at 180 °C for 15 min, an electrically conductive network consisting of more than 95 wt.% silver was formed and the network had a volume electrical resistivity in the order of magnitude of 10-5-10-6 Ω · cm and a sheet electrical resistivity in the order of magnitude of 10-4 Ω/square.
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一种均匀的导电银浆料
以i-丙基氨基甲酸银((CH3)2CHNHCOOAg)为前驱体制备了一种均匀导电银浆料。该前驱体在水和甲醇中的溶解度好,银含量高(约50 wt.%),分解温度低(低于200℃)。浆料为非牛顿流体,其粘度主要取决于增稠剂(乙基纤维素)的含量。将其应用于微笔直写过程中,可以产生高分辨率(20 μm左右)的阵列图案。以约40 wt.%银为前驱体的i-氨基甲酸丙酯直接写入浆料并在180℃下烧结15 min后,形成了含银量大于95 wt.%的导电网络,该网络的体积电阻率为10-5-10-6 Ω·cm,片电阻率为10-4 Ω/square。
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来源期刊
IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging 工程技术-材料科学:综合
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审稿时长
6 months
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