Interfacial Design of Anisotropic Conductive Adhesive Based Interconnects Using Molecular Wires and Understanding of Their Electrical Conduction

Abstract

Anisotropic conductive adhesives (ACAs) have been considered a promising interconnect material for next generation high performance devices. However, high joint resistance and low current carrying capability of ACA interconnects have been the limitations to utilizing ACAs in high power devices. In this study, we have introduced conjugated dithiols into ACA formulations to create molecular wire junctions between conductive fillers and metal pads as a means to facilitate the electron transport through the ACA joints. With the introduction of molecular wires, there is evidence of measured improvements in both the electrical conductivity and current carrying capability. The factors leading to these improvements in electrical properties are also discussed.