{"title":"Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature","authors":"C. Jang, B. Han, Samson Yoon","doi":"10.1109/TCAPT.2010.2063430","DOIUrl":null,"url":null,"abstract":"We address moisture diffusion in epoxy molding compounds (EMCs) at temperatures higher than 100°C. The objectives of this paper are thus: 1) to obtain diffusion properties of EMCs in both absorption and desorption modes at a wide range of temperatures; 2) to establish a non-Fickian correlation for diffusivity; and 3) to assess moisture diffusion behaviors during a solder reflow process, described by two different Fickian diffusivities of absorption and desorption and the non-Fickian diffusivity. An experimental procedure is established to measure the diffusivity and solubility of selected EMC materials. The results are utilized in a numerical simulation to analyze the effect of the non-Fickian diffusion characteristics on the moisture distribution during the reflow process.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"809-818"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2063430","citationCount":"28","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components and Packaging Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TCAPT.2010.2063430","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 28
Abstract
We address moisture diffusion in epoxy molding compounds (EMCs) at temperatures higher than 100°C. The objectives of this paper are thus: 1) to obtain diffusion properties of EMCs in both absorption and desorption modes at a wide range of temperatures; 2) to establish a non-Fickian correlation for diffusivity; and 3) to assess moisture diffusion behaviors during a solder reflow process, described by two different Fickian diffusivities of absorption and desorption and the non-Fickian diffusivity. An experimental procedure is established to measure the diffusivity and solubility of selected EMC materials. The results are utilized in a numerical simulation to analyze the effect of the non-Fickian diffusion characteristics on the moisture distribution during the reflow process.
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