Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for GaN HEMTs

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2022-06-01 DOI:10.1115/1.4054698
Han-Ling Li, Yang Shen, Y. Hua, S. Sobolev, B. Cao
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引用次数: 3

Abstract

Exact assessment of self-heating is of great importance to the thermal management of electronic devices, especially when completely considering the cross-scale heat conduction process. The existing simulation methods are either based on convectional Fourier's law or limited to small system sizes, making it difficult to deal with non-continuum thermal transport efficiently. In this paper, a hybrid phonon Monte Carlo-diffusion method is adopted to predict device temperature in ballistic-diffusive regime. Heat conduction around the heat generation region and boundaries are simulated by phonon Monte Carlo (MC) method, while the other domain is by Fourier's law. The temperature of the hybrid method is higher than that of Fourier's law owing to phonon ballistic transport, and the calculation efficiency of the hybrid method is remarkably improved compared with phonon MC simulation. Furthermore, the simulation results indicate that the way of modeling self-heating has a remarkable impact on phonon transport. The junction temperature of the heat source (HS) scheme can be larger than that of the heat flux (HF) scheme, which is opposite to the result under Fourier's law. In the HS scheme, the enhanced phonon-boundary scattering counteracts the broadening of the heat source, leading to a stronger ballistic effect and higher temperatures. The conclusion is verified by a one-dimensional analytical model. This work has opened up an opportunity for the fast and extensive thermal simulations of cross-scale heat transfer in electronic devices and highlighted the influence of heating schemes.
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氮化镓hemt弹道扩散自热模型的混合蒙特卡罗扩散研究
准确评估自热对电子器件的热管理具有重要意义,特别是在全面考虑跨尺度导热过程的情况下。现有的模拟方法要么基于对流傅立叶定律,要么局限于小系统尺寸,难以有效处理非连续热输运问题。本文采用混合声子蒙特卡罗-扩散方法预测了弹道扩散状态下的器件温度。用声子蒙特卡罗(MC)方法模拟了热生成区域和边界周围的热传导,另一个区域用傅立叶定律模拟。由于声子的弹道输运,混合方法的温度高于傅立叶定律的温度,与声子MC模拟相比,混合方法的计算效率得到了显著提高。此外,模拟结果表明,自加热的建模方式对声子输运有显著的影响。热源(HS)格式的结温可以大于热流通量(HF)格式的结温,这与傅里叶定律的结果相反。在HS方案中,声子边界散射的增强抵消了热源的展宽,导致更强的弹道效应和更高的温度。通过一维解析模型验证了这一结论。这项工作为电子设备中跨尺度传热的快速和广泛的热模拟提供了机会,并突出了加热方案的影响。
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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