{"title":"Use of multimode fiber and 850 VCSEL arrays for high-speed parallel interconnects","authors":"P.L. Pondillo","doi":"10.1109/LEOS.2001.969078","DOIUrl":null,"url":null,"abstract":"A brief overview of the high-speed interconnect market is presented, along with a discussion of why 50 micron multimode fiber ribbon coupled with VCSEL array technology makes the most sense as the optimal solution for this market.","PeriodicalId":18008,"journal":{"name":"LEOS 2001. 14th Annual Meeting of the IEEE Lasers and Electro-Optics Society (Cat. No.01CH37242)","volume":"51 6","pages":"841-842 vol.2"},"PeriodicalIF":0.0000,"publicationDate":"2001-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"LEOS 2001. 14th Annual Meeting of the IEEE Lasers and Electro-Optics Society (Cat. No.01CH37242)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LEOS.2001.969078","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
A brief overview of the high-speed interconnect market is presented, along with a discussion of why 50 micron multimode fiber ribbon coupled with VCSEL array technology makes the most sense as the optimal solution for this market.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
