Implantable flexible wireless pressure sensor module

Kyu-ho Shin, C. Moon, T. Lee, Chang-Hyun Lim, Youngjin Kim
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引用次数: 12

Abstract

A chip embedded flexible packaging scheme has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips (t<50 /spl mu/m) are fabricated by a chemical etching process to avoid possible surface damage. These technologies can be used for an implantable real-time monitoring of blood pressure. Our research targets are developing an implantable blood pressure sensor module and its telemetric measurement. By winding around the coronary arteries, we can measure the blood pressure by capacitance variation of blood vessels.
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可植入柔性无线压力传感器模块
提出了一种采用薄型硅芯片的芯片嵌入式柔性封装方案。通过弯曲试验和有限元分析研究了薄化硅片的力学特性。采用化学蚀刻工艺制备薄硅片(t<50 /spl mu/m),以避免可能的表面损伤。这些技术可用于植入式血压实时监测。我们的研究目标是开发一种植入式血压传感器模块及其遥测测量。通过缠绕冠状动脉,我们可以通过血管的电容变化来测量血压。
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