Flexible Film Loudspeaker Based on Piezoelectric PZT/Si Ultra-Thin MEMS Chips

T. Yamashita, T. Takeshita, Atsushi Oouchi, Takeshi Kobayashi
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引用次数: 1

Abstract

This paper presents a novel film type of flexible loudspeaker by ultra-thin piezoelectric PZT/Si bare chip integrated on flexible film substrate. The device is designed to operate without a closed membrane offering significant improvements with respect to manufacturability. We have revealed that a fully audible sound pressure level of around 40 dB at 6500 Hz was generated for a film with an ultrathin PZT/Si chip 1 × 5 mm2 in size. This technology is expected to be applied as electronic parts for surround or flexible parametric speakers for electronic paper and smartphones.
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基于压电PZT/Si超薄MEMS芯片的柔性薄膜扬声器
本文提出了一种将超薄压电PZT/Si裸片集成在柔性薄膜衬底上的新型薄膜型柔性扬声器。该设备设计为无封闭膜操作,在可制造性方面提供了显着改进。我们发现,对于尺寸为1 × 5 mm2的超薄PZT/Si芯片,在6500 Hz时可产生约40 dB的完全可听声压级。该技术有望应用于电子纸和智能手机的环绕声扬声器或柔性参数扬声器的电子部件。
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