G. Gong, Li Li, Wei Liu, M. Song, Xue-Song Xu, D.H. Ye, J. Yao
{"title":"Characterization of Al/Cu/W bond pad micro-corrosion","authors":"G. Gong, Li Li, Wei Liu, M. Song, Xue-Song Xu, D.H. Ye, J. Yao","doi":"10.1109/ISAPM.2011.6105706","DOIUrl":null,"url":null,"abstract":"In this paper, micro-corrosion of Al/Cu/W bond pad was studied. During DI water cleaning process, theta phase Al2Cu and surrounding Al performed well as typical galvanic cell, resulting in pad metal micro-corrosion. DI water with Pb2+ is thought to be outside electrical path of the galvanic cell. It is firmly believed that Pb-contained particles on top of Al2Cu and surrounding Al oxide and/or hydroxide were the cathodic and anodic reaction product respectively.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Symposium on Advanced Packaging Materials (APM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2011.6105706","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In this paper, micro-corrosion of Al/Cu/W bond pad was studied. During DI water cleaning process, theta phase Al2Cu and surrounding Al performed well as typical galvanic cell, resulting in pad metal micro-corrosion. DI water with Pb2+ is thought to be outside electrical path of the galvanic cell. It is firmly believed that Pb-contained particles on top of Al2Cu and surrounding Al oxide and/or hydroxide were the cathodic and anodic reaction product respectively.
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