A Framework for Semi-Automated Fault Detection Configuration with Automated Feature Extraction and Limits Setting

Haoshu Cai, Jianshe Feng, J. Moyne, Jimmy Iskandar, M. Armacost, Fei Li, J. Lee
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引用次数: 4

Abstract

In today’s microelectronics manufacturing facilities, fault detection (FD) is pervasive as the primary advanced process control (APC) capability in use. The current approach to FD, while effective, has a number of shortcomings that impact its cost and effectiveness. The highest among these is the cost in time and resources associated with the largely manual methods used for partitioning and extraction of features of interest in individual traces. Additionally, once these features are extracted, feature-based univariate analysis (UVA) is the primary method used for process monitoring and FD, which fails to incorporate process variable correlations in detecting faults and quality issues. On the other hand, current multivariate analysis (MVA) approaches, such as principal component analysis (PCA), partial least squares (PLS), and their variants, focus on threshold setting in a multivariate space so that they cannot provide direct limit settings on raw (sensor) parameters for decision-making support during online process monitoring. Also, in bypassing feature identification and extraction, the subject matter expert (SME) is largely left out of the loop in MVA analysis; thus, information on the relationship between univariate features and faults is not captured. Furthermore, it is difficult to visualize and understand multivariate limits due to the high dimensionality of the data produced in microelectronics manufacturing processes. Finally, slow and normal process changes often occur in real processes, which can lead to false alarms during implementation when using models trained from offline samples. Thus, a need exists for an FD method that leverages the existing feature-based UVA and provides (1) a method for automated signal partitioning and feature extraction that allows for SME input, (2) an MVA mechanism which considers correlation among parameters and is adaptive to the normal process drift, (3) an automatic approach for limiting UVA features that captures the correlation among parameters, and (4) a methodology for easily viewing these capabilities so that an SME is able to view, understand, and continue to contribute to the FD optimization process. This capability has been developed and successfully applied to microelectronics manufacturing data sets and is proposed as a key component to future microelectronics smart manufacturing systems.
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具有自动特征提取和限制设置的半自动故障检测配置框架
在当今的微电子制造设施中,故障检测(FD)作为主要的先进过程控制(APC)功能在使用中普遍存在。目前的FD方法虽然有效,但存在一些影响其成本和有效性的缺点。其中最高的代价是时间和资源成本,这些成本与用于划分和提取单个轨迹中感兴趣的特征的大部分手动方法相关。此外,一旦提取了这些特征,基于特征的单变量分析(UVA)是用于过程监控和FD的主要方法,它无法在检测故障和质量问题时纳入过程变量相关性。另一方面,当前的多变量分析(MVA)方法,如主成分分析(PCA)、偏最小二乘(PLS)及其变体,侧重于多变量空间中的阈值设置,因此它们不能为在线过程监控期间的决策支持提供原始(传感器)参数的直接限制设置。此外,在绕过特征识别和提取的过程中,主题专家(SME)在很大程度上被排除在MVA分析的循环之外;因此,关于单变量特征和故障之间关系的信息没有被捕获。此外,由于微电子制造过程中产生的数据的高维性,很难可视化和理解多变量限制。最后,缓慢而正常的流程更改经常发生在实际流程中,当使用从离线样本中训练的模型时,这可能导致在实现过程中出现假警报。因此,需要一种FD方法,利用现有的基于特征的UVA,并提供(1)一种允许SME输入的自动信号划分和特征提取方法,(2)一种考虑参数之间相关性并适应正常过程漂移的MVA机制,(3)一种限制UVA特征的自动方法,捕获参数之间的相关性,以及(4)一种轻松查看这些功能的方法,以便SME能够查看,了解并继续为FD优化过程做出贡献。这种能力已被开发并成功应用于微电子制造数据集,并被提议作为未来微电子智能制造系统的关键组成部分。
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