System design for junction temperatures up to 200°C

Abstract

Manufacturers of power semiconductors and modules intend to rate the maximum junction temperature up to 200°C. This results in higher temperatures at other components of the inverter system as well. In this paper, it is presented a method to identify thermal constraints in an inverter design by combining analytical and numerical analysis of the thermal spreading. Furthermore, an overview of the thermal limits of the inverter's components is given. The resulting thermal constraints of an air-cooled system are discussed, and it is introduced an inverter design to avoid over-temperatures. Finally, the test results achieved from the constructed inverter at 200°C junction temperature are presented.